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Half-thermosetting anisotropic conductive film composition

An anisotropic and thermosetting technology, applied in the field of anisotropic conductive film composition, can solve the problems of reduced reliability, difficult control of thermoplastic resin shrinkage and expansion, etc.

Inactive Publication Date: 2008-07-02
CHEIL IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But it is not easy to obtain good compatibility of curing system, sufficient film strength and tension
In addition, control of shrinkage and expansion of thermoplastic resins is not easy, and thermosetting resins can inhibit curing reactions in low-temperature operations, thereby significantly reducing reliability in hot and humid environments

Method used

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  • Half-thermosetting anisotropic conductive film composition
  • Half-thermosetting anisotropic conductive film composition
  • Half-thermosetting anisotropic conductive film composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] Example 1: 80 g of carboxylated acrylonitrile butadiene copolymer (1072CGX, Zeon Chemicals, weight average molecular weight=204,400) was dissolved in a mixed solvent of toluene / methyl ethyl ketone (2 / 1, weight ratio) to reach 24% solids content.

[0049] Then add 75 g of bisphenol A type epoxy acrylate resin (VR60, Showa Highpolymer Co.LTD. weight average molecular weight = 7,500) dissolved in methyl ethyl ketone to a solid content of 60%, and add 45 g of 2,500 weight average molecular weight Acrylate resin [the following formula (1)].

[0050] 13g and 4g of pentaerythritol triacrylate (weight-average molecular weight=298) and 2-acryloyloxyethyl phosphate (weight-average molecular weight=196) with three acrylate functional groups were added respectively, and 4g of Benzoyl peroxide was added to a solids content of 10%.

[0051] 1.7 g of a silane coupling agent having a methacryloxy group (3-glycidoxypropyltriethoxysilane) and 19 g of nickel (Ni) particles were added to...

Embodiment 2

[0054] Example 2: An ACF composition was prepared according to the method of Example 1 except that 80 g of carboxylated acrylonitrile butadiene dissolved in a mixed solvent of toluene / methyl ethyl ketone (2 / 1 by weight) to a solids content of 25% was used Carboxylated acrylonitrile butadiene copolymer (N34, Zeon Chemicals, weight average molecular weight = 236,400) was substituted for carboxylated acrylonitrile butadiene copolymer (1072CGX, Zeon Chemicals, weight average molecular weight = 204,400).

Embodiment 3

[0055] Example 3: An ACF composition was prepared according to the method of Example 1, except that 80 g of acryl rubber (SG-80H, Nagase Chemtex, weight average molecular weight=350,000) dissolved in methyl ethyl ketone to a solid content of 26% was used instead Carboxylated acrylonitrile butadiene copolymer (1072CGX, Zeon Chemicals, weight average molecular weight = 204,400).

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Abstract

The implement method of the present invention relates to a half thermosetting anisotropism conductive membrane composition, including thermoplastic resin containing about 150,000 to 600,000 of weight-average molecular weight, thermosetting material containing about 100 to 10,000 weight-average molecular weight and acrylic ester or methacrylic acid ester functional group, organic peroxide, silicane coupling agent and conductive particle.

Description

[0001] Pursuant to U.S.C. §119, this non-provisional application requires filing with the Korean Patent Office in Korea with filing dates of 10-2006-0138670 on December 29, 2006 and 10-2007-0109690 on October 30, 2007 The priority of the patent application, the entire content of which is hereby incorporated by reference. technical field [0002] Embodiments of the present invention relate to semi-thermosetting anisotropic conductive film compositions. More specifically, embodiments of the present invention relate to an anisotropic conductive film composition comprising a high molecular weight thermoplastic resin and a thermosetting material that provides a dense cured structure, thus exhibiting superior quality and yield, improved availability on a module production line Operability and productivity as well as superior adhesion and contact resistance, even with a short connection process. Background technique [0003] Generally, an anisotropic conductive film composition (A...

Claims

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Application Information

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IPC IPC(8): C08L33/04C08L23/00C08L47/00C08L33/20C08L29/14C08L71/12C08L63/00C08K5/00C08K13/02C09J133/04C09J123/00C09J147/00C09J133/20C09J129/14C09J171/12C09J163/00H01B1/20
CPCC08J3/20C08J5/18C08K5/14C08L33/08C08L33/10C08L2203/20
Inventor 尹康培朴憬修李天石
Owner CHEIL IND INC
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