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Lead-free metallic material for electronic component

A lead-free solder and product technology, used in welding/welding/cutting items, welding media, welding equipment, etc. Problems such as wire drawing, deterioration of mechanical properties and plastic workability, etc., to achieve the effect of improved welding bond strength and reliability, excellent oxidation resistance, good bond strength and reliability

Inactive Publication Date: 2008-07-02
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because these solders contain a large amount of elements that can cause embrittlement, for example, deterioration of mechanical properties and plastic workability, it is difficult to ensure satisfactory solder joint strength and reliability
Furthermore, these lead-free solders are likely to cause brittle fracture etc. when plastically processed, and therefore, it is difficult for these lead-free solders to successfully withstand extrusion, rolling, wire drawing, etc.
Therefore, shaped products in the form of strips or filaments are basically impossible to produce
Based on the above reasons, the application of lead-free solder is greatly limited

Method used

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  • Lead-free metallic material for electronic component
  • Lead-free metallic material for electronic component
  • Lead-free metallic material for electronic component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0073] A lead-free solder consisting of tin-9.0 wt% zinc-0.1 wt% tantalum was melted and the melt was cast into a billet with a diameter of 100 mm and a length of 300 mm. The billets were then extruded into rods 10 mm thick and 70 mm wide. The bars were then rolled to form strips 100 μm thick and 70 mm wide.

[0074] Then, as shown in FIG. 7, flux is coated on the surface of the copper plate 100 with a thickness of 3 mm, a width of 50 mm, and a length of 60 mm shown in FIG. Coated copper plate 100. Next, a copper-plated SiN substrate 101 having a thickness of 0.5 mm, a width of 30 mm, and a length of 40 mm was placed on the upper portion of the ribbon-shaped solder 102 . The assembly was heated for 45 seconds at a temperature of 230° C. in a nitrogen atmosphere to reflow. Thermal cycle tests were performed on the connection products thus obtained at temperatures ranging from -25°C to 125°C. After 2,000 cycles of thermal cycle testing, connected products are tested with ult...

Embodiment 2

[0076] A lead-free solder consisting of tin-0.5wt% copper-2.5wt% silver-4.0wt% indium-0.1wt% tantalum-0.1wt% cobalt was melted and the melt was cast into a billet with a diameter of 100 mm and a length of 300 mm. The billets were then extruded into rods 10 mm thick and 70 mm wide. The bars were then rolled to form strips 100 μm thick and 70 mm wide.

[0077] Then, as shown in Figure 7, flux is coated on the surface of the copper plate 100 of thick 3mm, wide 50mm, long 60mm, then the strip solder 102 of thick 100 μm, wide 40mm, long 50mm is placed on the copper plate that has been coated. 100 on. Next, a copper-plated SiN substrate 102 having a thickness of 0.5 mm, a width of 30 mm, and a length of 40 mm was placed on the upper portion of the ribbon-shaped solder 101 . The assembly was heated at a temperature of 250° C. in a nitrogen atmosphere for 45 seconds to reflow. Thermal cycle tests were performed on the connection products thus obtained at temperatures ranging from -...

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Abstract

The present invention provides a lead-free solder, which has good oxidation resistance and can be easily and well plastically processed. The lead-free solder and lead-free solder shaped articles can provide solder joint articles, especially electronic parts, which have high reliability, for example, mechanical strength and connection strength. The present invention also provides solder joint products and electronic components connected by the lead-free solder.

Description

technical field [0001] The present invention relates to a lead-free solder having good oxidation resistance, mechanical properties and wettability and being easy to be plastically processed, a solder joint product and an electronic component manufactured by connecting with the lead-free solder. Background technique [0002] In recent years, people are paying more and more attention to environmental issues for global environmental protection. Under such circumstances, an increase in the amount of discarded industrial waste has become a serious problem. Solder used in, for example, substrates of power control computers included in industrial waste, home appliances, and personal computers Included in industrial waste is solder used in industrial waste. Harmful heavy metals such as lead sometimes leach from these solders. For example, when solder flows out, lead acts on acid rain, etc. to produce lead-containing aqueous solution, and the aqueous solution often seeps into groun...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/02B23K101/00B23K101/36
CPCB23K35/262C22C13/00B23K35/40C22C30/04B23K2101/36
Inventor 龙坦桐久里裕二
Owner KK TOSHIBA
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