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Thin film-laminated polyimide film and flexible printed wiring board

A polyimide film and film lamination technology, which is applied in the fields of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problems of unresolved potential distortion, etc.

Active Publication Date: 2008-06-04
TOYOBO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, even if significant film warpage, ie, exposed film warpage, etc., could be eliminated, it did not solve the problem of potential distortion that could be exposed due to curling at high temperatures, which is critical for high temperature processing for electronic parts especially necessary

Method used

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  • Thin film-laminated polyimide film and flexible printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-3

[0190]The container equipped with nitrogen inlet tube, thermometer, stirring bar was replaced with nitrogen, and P-PDA was placed therein. Then, DMAC was added, and after complete dissolution, BPDA was added, and at 25°C, while adjusting the monomer charge concentration to 15% by mass, in DMAC with P-PDA and BPDA as monomers The mixture was polymerized by stirring at a molar ratio of 1 / 1 for 5 hours. As a result, a brown viscous polyamic acid solution was obtained. Per 100 parts by mass of the obtained polyamic acid solution, AA (15 parts by mass) and IQ (3 parts by mass) were added, and the mixture was coated on a polyester film having a thickness of 188 μm and a width of 800 mm over a coating width of 740 mm (COSMOSHINE (registered trademark) A4100, manufactured by Toyo Boseki Kabushiki Kaisha) on a lubricant-free surface (squeegee / belt gap: 430 μm). The film was dried in a tunnel through a continuous drying oven with 4 drying zones. In each zone, for each of the upper an...

Embodiment 4-6

[0212] The container equipped with a nitrogen inlet tube, a thermometer, and a stirring bar was replaced with nitrogen, and the P-PDA was placed therein. Then, DMAC was added, and after complete dissolution, BPDA was added, and at 25°C, while adjusting the monomer charge concentration to 15% by mass, in DMAC with P-PDA and BPDA as monomers The mixture was polymerized by stirring at a molar ratio of 1 / 1 for 5 hours. As a result, a brown viscous polyamic acid solution was obtained. The obtained polyamic acid solution was applied onto a stainless steel belt (gap between blade / belt: 450 μm), and dried in the same manner as in Production Examples 1-3. Each green film, Production Example 4, Production Example 5, and Production Example 6 was obtained by releasing a polyamic acid film which became self-supporting after drying from a stainless steel belt.

[0213] The obtained raw film was heated in two steps under the conditions of the first step: 180°C, 3 minutes, the heating rate ...

Embodiment 7-9

[0217] Per 100 parts by mass of the polyamic acid solution obtained in Production Example 1, AA (15 parts by mass) and IQ (3 parts by mass) were added, and the mixture was applied to a stainless steel belt (gap of scraper / belt: 430 μm ), and dried in a drier similar to that in Production Examples 1-3. Drying conditions (temperature at 30 mm above and below the film) were as follows.

[0218] The temperature in the horizontal zone is 25°C, and the air volume is zero

[0219] Temperature above and below zone 1: 110°C

[0220] Air volume above and below: 20-25m 3 / minute

[0221] Temperature above and below zone 2: 120°C

[0222] Air volume above and below: 20-25m 3 / minute

[0223] Temperature above and below the third zone: 120°C

[0224] Air volume above and below: 20-25m 3 / minute

[0225] Temperature above and below zone 4: 120°C

[0226] Air volume above and below: 20-25m 3 / minute

[0227] ...

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Abstract

The thin film-laminated polyimide film contains a substrate film and a thin film layer formed at least on one surface of the substrate film. The substrate film is made of a polyimide film showing a degree of curl after a heat treatment at 300°C of not more than 10%. Use of this thin film-laminated polyimide film as a substrate of electronic parts such as solar battery, capacitor and the like exposed to high temperatures prevents easy development of warpage and distortion during production, and can improve quality and yield of electronic parts.

Description

technical field [0001] The present invention relates to a thin-film-laminated polyimide film used for flexible printed circuit substrates and the like that play an important role in miniaturization and weight reduction of electronic devices and electronic parts. More specifically, the present invention relates to a polyimide film for thin film lamination of flexible printed circuit substrates subjected to TAB, COF, PGA, etc. for semiconductor packaging and the like, including The film is a polyimide film with special properties, wherein the polyimide film made of conductive thin film laminate exhibits less warping and curling. Background technique [0002] Conventionally, a metallized polyimide film is known for use in a so-called bonded type flexible printed circuit substrate in which an adhesive is used to bond the polyimide film to a metal foil such as copper foil, aluminum foil, or the like. These films have the following problems which are believed to be attributable t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/34
CPCH05K2201/0317H05K2203/065H05K1/0346H05K3/181H05K2201/0326H05K3/388H05K2201/0154Y10T428/31721Y10T428/31681B32B27/34
Inventor 前田乡司河原惠造堤正幸吉田武史
Owner TOYOBO CO LTD
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