Low temperature aerosol deposition of a plasma resistive layer

Abstract

Embodiments of the present invention provide a method of low temperature air flotation deposition of a plasma resistant layer on semiconductor chamber components / parts. In one embodiment, a method for low temperature air flotation deposition comprises forming an air flotation of fine particles in an air flotation generator, distributing said air flotation from the generator into a processing chamber towards a substrate surface, maintaining the The substrate temperature is between about 0 degrees Celsius and 50 degrees Celsius, and a layer of material from the air flotation is deposited on the substrate surface.

Description

technical field [0001] Embodiments of the present invention relate generally to semiconductor processing and, more particularly, to low temperature air flotation deposition of plasma resistant layers on semiconductor processing chamber components. Background technique [0002] Semiconductor processing involves several different chemical and physical steps that form tiny integrated circuits on a substrate. The layers of various materials making up the integrated circuit are produced by chemical vapor deposition, physical vapor deposition, epitaxial growth, and the like. Partial layers of multiple materials are patterned using photoresist masks and wet or dry etching techniques. The substrates used to form integrated circuits can be silicon, gallium arsenide, indium phosphide, or other suitable materials. [0003] A typical semiconductor processing chamber includes a chamber defining a processing zone, a gas distribution assembly adapted to supply gas from a gas supply to th...

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Problems solved by technology

However, high temperature treatment may invalidate the surface properties or deleteriously modify the microstructure of the coating surface, resulting in coatings with poor uniformity and / or surface cracks due to elevated temperature

Additionally, if the coating, or the underlying surface of that coating, has microcracks or if the coating is applied unevenly, the component surface can become damaged over time and eventually expose the underlying component surface to corrosive plasma bombardment

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