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Packaging cover board, chip packaging structure and manufacturing method thereof

A technology of chip packaging structure and packaging cover plate, applied in semiconductor/solid-state device manufacturing, radiation control devices, electrical components, etc., can solve the problem of affecting the quality of optical components, low light penetration rate of chip packaging structure, and low light penetration rate and other issues, to achieve the effect of good light transmittance and improve process yield

Inactive Publication Date: 2008-04-16
UNITED MICRODISPLAY OPTRONICS CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to provide a packaging cover plate, which can solve the shortcomings of the low light transmittance of the existing chip packaging structure
[0009] Another object of the present invention is to provide a chip packaging structure, which can solve the shortcomings of the existing chip packaging structure, such as low process yield, high manufacturing cost, low light transmittance, and affecting the quality of optical components.
[0010] Another object of the present invention is to provide a method for manufacturing a chip packaging structure, which can solve the shortcomings of the existing chip packaging structure, such as low process yield and high manufacturing cost.

Method used

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  • Packaging cover board, chip packaging structure and manufacturing method thereof
  • Packaging cover board, chip packaging structure and manufacturing method thereof
  • Packaging cover board, chip packaging structure and manufacturing method thereof

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Embodiment Construction

[0055] Please refer to figure 2 and image 3 , figure 2 A schematic cross-sectional view showing a chip packaging structure according to a preferred embodiment of the present invention, image 3 then draw figure 2 A schematic top view of the chip package structure. The chip package structure 300 of this embodiment includes a chip 310 , a package cover 320 and an adhesive layer 330 . Wherein, the chip 310 has an active surface 312 , and an image sensing element 314 and a plurality of pads 316 located around the image sensing element 314 are disposed on the active surface 312 . In one embodiment, the image sensing element 314 includes, for example, a contact image sensor or a complementary metal oxide semiconductor image sensor (CMOS image sensor), which is used to receive an external light signal, and transmit the light through the chip 310 The signal is converted into an electrical signal for processing. The image sensing element 314 is electrically connected to the s...

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Abstract

A chip package structure comprises a chip, a package cover board and a bound layer, wherein, the chip is provided with a drive surface which is provided with an image sensing element and a plurality of connection cushions positioned on the periphery of the sensing element. In addition, the package cover board is arranged above the drive surface and comprises a baseplate and a support part positioned on the baseplate, wherein, a holding room is left on the baseplate by the support part, the support part contacts with the drive surface of the chip to ensure the image sensing element on the drive surface arranged in the holding room. Besides, the bound layer is arranged between the support part and the drive surface. The chip package structure of the invention has the advantages of high rate of finished products of technique, low cost of production and good optical penetrating power.

Description

technical field [0001] The invention relates to a chip packaging structure and a manufacturing method thereof, and in particular to a chip packaging structure with a packaging cover plate and a manufacturing method thereof. Background technique [0002] In the semiconductor industry, the production of integrated circuits (IC) is mainly divided into three stages: wafer manufacturing, IC manufacturing, and IC packaging. Among them, the bare chip (die) is completed through the steps of wafer fabrication, circuit design, photomask (mask) fabrication, and wafer saw (wafer saw), and each bare chip formed by wafer dicing is passed through the bare chip After the contacts on the chip are electrically connected to external signals, the bare chip can be covered with a molding compound. The purpose of its packaging is to prevent the bare chip from being affected by moisture, heat, and noise, and to provide a medium for electrical connection between the bare chip and the external circu...

Claims

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Application Information

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IPC IPC(8): H01L23/04H01L27/146H01L21/50H01L21/52
CPCH01L2924/16235
Inventor 官大双白东尼韩宗立
Owner UNITED MICRODISPLAY OPTRONICS CORP
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