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Anisotropic conductive adhesive

A technology of conductive fillers and catalysts, applied in the direction of conductive adhesives, adhesives, conductive adhesive connections, etc., can solve problems such as long bonding time, high bonding temperature, short shelf life and working life

Inactive Publication Date: 2007-09-12
HENKEL KGAA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] [0005] The disadvantage of anisotropic conductive adhesive is that it requires high bonding temperature and long bonding time
Further disadvantages include short shelf life and working life

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0018]Example: Two samples of an anisotropic conductive adhesive were prepared as follows (the contents of all components are expressed in weight percent (wt. %)). Add the resin mixture to a mixing vessel fitted with a propeller agitator. Add catalyst and mix until fully dissolved. The adhesion promoter and surfactant are then added, followed by the conductive filler and the composition is mixed for 5-10 minutes. The mixture was degassed in a vacuum chamber at >28 in Hg for 5 minutes. The formulations of the two samples are listed in Table 1.

[0019]

components

Sample A

(wt.%)

Sample B

(wt.%)

Silica Nanoparticle Reinforced

Cycloaliphatic epoxy resin 1

87.72

74.12

Potential cationic curing agent 2

1.36

1.15

Adhesion promoter 3

0.93

0.76

Degasser 4

--

0.17

rheology modifier 5

--

1.12

Gold-Coated Polymer Conductive Fi...

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PUM

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Abstract

An anisotropic conductive adhesive that provides strong adhesion to metals and organic substrates to generate stable and reliable electric interconnects. The adhesive provides the benefits of short thermocompression bond time at low temperatures. The adhesive contains cationic curable resin, latent cationic catalyst that thermally cures the resin at high speeds and low temperatures, conductive filler, optionally a film forming thermoplastic solid resin and optionally nano size filler. The optional nano filler provides the benefit of reducing the coefficient of thermal energy mismatch, improving the adhesion strength and reducing the total heat of reaction for the system.

Description

technical field [0001] [0001] The present invention relates to compositions suitable for use as conductive materials in microelectronic devices or semiconductor packages to provide electrically stable interconnections. Background technique [0002] [0002] Conductive compositions are used for various purposes in the manufacture and assembly of semiconductor packages and microelectronic devices. For example, conductive adhesives are used to bond integrated circuit chips to substrates (die attach adhesives), or to bond circuit components to printed circuit boards (surface mount conductive adhesives). [0003] [0003] More specifically, anisotropic conductive adhesives have been used for the interconnection of various electronic components, including chip-on-glass assemblies, flip chip on flexible substrates flex assembly), contactless smart-card module assembly, and bard chopattach on flexible or rigid substrates. The benefits that anisotropic conductive adhesives offer for pa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/02C09J163/00C09J11/06H01L23/29
CPCC08K3/36H05K2201/0129H01B1/22C08G59/24H05K2201/0257H01R4/04C09J163/00H05K2201/0209H05K3/323B82B3/00C09J9/02
Inventor 郑志明J·P·沙B·夏
Owner HENKEL KGAA
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