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Method of polishing normal pressure plasma

A normal-pressure plasma and plasma technology, applied in the polishing field, can solve the problems of difficult surface cleaning, surface and sub-surface damage, low efficiency, etc.

Active Publication Date: 2007-09-12
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to address the deficiencies of the conventional mechanical polishing method in the processing of large light-weight mirrors, and the low efficiency and easy occurrence of ultra-smooth surface processing of hard and brittle difficult-to-machine materials such as silicon carbide. Surface and subsurface damage, surface cleaning difficulties, etc., provide an atmospheric pressure plasma polishing method

Method used

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Experimental program
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specific Embodiment approach 1

[0005] Specific embodiment one: (referring to Fig. 1, Fig. 2) the device of this embodiment is composed of airtight working cabin 51, first linkage system 52, plasma torch 53, workbench 56, second linkage system 57, radio frequency power supply 58, radio frequency Matching device 59, first flow controller 60, reaction gas bottle 61, plasma gas bottle 62, gas recovery treatment device 63, negative pressure pump 64 (optional accessory), second flow controller 65, water inlet pipe 68 and outlet Composed of water pipes 69, the first linkage system 52 and the second linkage system 57 are fixed together on the common base 54 on the inner wall of the bottom of the airtight working cabin 51, and the plasma torch 53 is installed on the first linkage system 52 and can be used in the second A linkage system 52 realizes linear motion and rotary motion. The first linkage system 52 is mainly used to adjust the distance between the plasma torch 53 and the workpiece 55 to ensure that the axis ...

specific Embodiment approach 2

[0006] Specific embodiment two: (referring to Fig. 2) the plasma torch 53 of the present embodiment is made of anode water-cooled conduit 1, air inlet joint 3, cathode water-cooled joint one 4, anode 5, cathode 6, cathode water-cooled joint two 8, outer jacket 9, Composed of ceramic nut 10, connecting body 11, and connecting nut 12, the cathode 6 is fixedly connected to the outer casing 9, a water-cooled annular space 13 is formed between the outer wall of the cathode 6 and the inner wall of the outer casing 9, and the cathode water-cooling joint 4 is fixed on one side of the outer casing 9. The outer wall is connected with the water-cooled annular space 13, and the cathode water-cooled connector 2 8 is fixed on the outer wall of the other side of the jacket 9 and communicated with the water-cooled annular space 13. The right end of the ceramic nut 10 is fixedly connected with the left end of the cathode 6, and the connecting body The right end of 11 is fixedly connected with t...

specific Embodiment approach 3

[0007] Embodiment 3: In step 4 of this embodiment, the volume ratio of the plasma gas to the reaction gas is 5:1˜950:1. Other methods and steps are the same as those in the first embodiment.

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Abstract

The normal pressure plasma polishing method is provided. The normal pressure plasma polishing method includes providing plasma gas and reaction gas in the volume ratio of 4-1000; and starting RF power source and increasing power gradually while controlling the reflected power to zero, with the initial effective power being 180-240 W, normal power being 400-1200 W, and maximum power being 1500 W. The present invention realizes super smooth surface machining by means of plasma chemical reaction at normal pressure, and has no need of vacuum chamber, low cost, wide application range, high machining efficiency, no surface damage and contamination, and high surface smoothness up to 1nm Ra.

Description

technical field [0001] The invention relates to a polishing method. Background technique [0002] The development of modern short-wave optics, strong light optics, electronics and thin film science has very strict requirements on the surface, and its obvious characteristic is that the surface roughness is less than 1nm Ra. When this type of surface is used as an optical element, in order to obtain the highest reflectivity, special emphasis is placed on low surface scattering characteristics or extremely low roughness values; when used as a functional element, because most of them are crystal materials, more attention is paid to the surface roughness. Lattice integrity of the surface. We collectively refer to these two types of surfaces as ultra-smooth surfaces. The root mean square value of microscopic undulations on ultra-smooth surfaces is several atoms in size, so the key to realizing ultra-smooth surface processing is to realize the removal of surface materials at the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B1/00
Inventor 王波张巨帆董申张龙江
Owner HARBIN INST OF TECH
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