Laser processing apparatus, laser processing head and laser processing method

Abstract

A laser processing apparatus is provided. The laser processing apparatus includes a laser processing head having a transmission window, an opening portion, an outlet hole, a first vent hole and a second vent hole. The transmission window transmits laser light by which a processing object is irradiated. The opening portion passes the transmitted laser light to a bottom portion of the laser processing head. The outlet hole discharges an atmosphere in the vicinity of a laser light irradiation region of the processing object to the outside. The first vent hole directs gas into the vicinity of the laser light irradiation region. The second vent hole discharges the atmosphere in the vicinity of the laser light irradiation region. Debris generated from the processing object is discharged from the outlet hole and the second vent hole that are continuous with the opening portion provided at the bottom portion of the laser processing head.

Description

technical field [0001] The present application relates to a technique of performing patterning processing on a transparent conductive film used as a transparent electrode on a multilayer film of an FPD (Flat Panel Display) or the like. In particular, the present application relates to a laser processing device, a laser processing head, and a laser processing method for removing and discharging waste chips based on ablation, thermal melting, Particles and products produced during laser processing of (thermofusion) or a mixture of the two. Background technique [0002] Transparent conductive films are used as transparent electrodes for array substrates (multilayer film substrates) for flat panel displays, solar cells, and the like. Likewise, transparent conductive films are also widely used as transparent electrodes in the field of electronic paper, and the current development of electronic paper has been considered as a future display device and its application has also been...

AI Technical Summary

Problems solved by technology

[0010] However, even if suction and discharge of waste debris were attempted by blowing off the debris on the surface near the treatment area as described in Method 1, the waste debris was still dispersed, and therefore it was difficult to completely remove and discharge the debris even if the suction power was increased. discharge waste

[0011] In addition, even if the auxiliary gas is blown onto the processing area from the inner nozzle as described in method 2, the waste chips are still scattered and deposited near the processing area again, so even if the suction power of the outer nozzle is increased, it is difficult to sufficiently effectively remove debris

[0012] In addition, even if the pressure inside the closed space part provided with the opening part is reduced as described in method 3, waste chips are not necessarily deposited in the opening part, and therefore, waste chips in the central part of the processing area that still exists will be redeposited in the processing area. problems on the surface of an object

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