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Use of decamethylene diamine in preparing copolyamide hot sol

A technology of copolyamide and hot-melt adhesives, which is applied in the direction of adhesives, etc., can solve the problem of high cost, achieve the effects of reducing production costs, simplifying the process flow, and convenient operation

Active Publication Date: 2009-11-18
WUXI YINDA NYLON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Copolyamide hot melt adhesives produced abroad generally contain nylon-11 or nylon-12 monomers, the proportion can reach more than 50-60%, and the relative cost is relatively high

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] The raw material ratio is as follows:

[0027] Decanediamine, sebacic acid 45 mass ratio (equal molar ratio of sebacic acid and decanediamine)

[0028] Caprolactam 30 mass ratio

[0029] Nylon 66 salt 25 mass ratio (or equimolar ratio of hexamethylenediamine and adipic acid added)

[0030] Benzoyl ≤5‰

[0031] Appropriate amount of water, antioxidant 1010, phosphorous acid, etc.

[0032] Feed according to the above ratio, vacuumize to -0.098Mp a , replaced by nitrogen three times, heated to 230°C, pressure 1.4Mp a , after keeping the pressure for 2 hours, slowly reduce the pressure, drop to normal pressure within 3 hours, the temperature rises to 240°C, continue the reaction for 2 hours, discharge, water-cooled and pelletized to obtain a copolyamide hot-melt adhesive resin. The index detection results are:

[0033] Melting point: 110-120°C

[0034] Melt index: ≥30g / 10min

[0035] Molecular weight: 18000-20000

[0036] Relative viscosity: 1.8

Embodiment 2

[0038] The raw material ratio is as follows:

[0039] Decanediamine, sebacic acid 35 mass ratio (equal molar ratio of sebacic acid and decanediamine)

[0040] Nylon 610 salt 15 mass ratio (or equimolar ratio of hexamethylenediamine and sebacic acid)

[0041] Nylon 66 salt 20 mass ratio

[0042] Caprolactam 30 mass ratio

[0043] Appropriate amount of water, antioxidant 1010, phosphorous acid, etc.

[0044] Feed according to the above ratio, vacuumize to -0.098Mpa, replace with nitrogen three times, raise the temperature to 220°C, the pressure is 1.3Mpa, keep the pressure for 2.5 hours, slowly reduce the pressure, drop to normal pressure within 3 hours, and the temperature rises to 230°C, Continue to react for 2.5 hours, discharge, water-cooled and pelletized to obtain copolyamide hot-melt adhesive resin. The index detection results are:

[0045] Melting point: 100-110°C

[0046] Melt index: ≥40g / 10min

[0047] Molecular weight: 15000-18000

[0048] Relative viscosity: ...

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Abstract

The invention relates to the application of a class of long carbon chain diamine products in the preparation of copolyamide hot-melt adhesives, in particular the application of decane diamine products in the preparation of copolyamide hot-melt adhesives. Its main technical solutions are: ① Decanediamine does not need to be salt-formed, and can be directly fed to participate in copolymerization to obtain hot-melt adhesives; ② Copolymerized hot-melt adhesives can be composed of ternary components or multiple components; ③ Copolymerized hot-melt adhesives generally contain a , b Two basic units: a. Two or more C6-13 diamines and two or more C6-13 dibasic acids (amine, acid equimolar ratio); b. Caprolactam or ε-aminocaproic acid ; The two units of a and b are composed of: raw material a.60-80%; raw material b.20-40%. Decanediamine belongs to a raw material. Adopting the preparation method of the invention can simplify the technological process, reduce the production cost, and make the operation convenient. The copolyamide hot-melt adhesive produced is widely used in industries such as garment adhesive interlining, shoemaking, automobile industry, packaging and printing.

Description

technical field [0001] The invention relates to the application of a class of long carbon chain diamine products in the preparation of copolyamide hot-melt adhesives, in particular the application of decane diamine products in the preparation of copolyamide hot-melt adhesives. Background technique [0002] Copolyamide hot melt adhesive is also called nylon hot melt adhesive. It is a thermoplastic nylon resin compounded with polyamide resin as the matrix and other auxiliary components. The outstanding advantages of copolyamide hot melt adhesives are: low melting temperature, narrow melting point range, strong polarity, high bonding strength, good processing performance, good wear resistance, strong chemical resistance, good flexibility and washing resistance properties, etc., so that it occupies a considerable market in the field of fiber fabric bonding, and is often used in fusible interlinings, leather fusible interlinings, shoes and hats, etc., and is also widely used in ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J177/06
Inventor 殷新中
Owner WUXI YINDA NYLON
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