High Speed Handling of Ultra-Small Chips by Selective Laser Bonding and Debonding
a laser bonding and debonding technology, applied in metal working equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of affecting the throughput and cost performance of the fan-out package, requiring hundreds of hours to get a reconstituted 12-inch wafer via pick-and-place processing, and affecting the speed of the process. , to achieve the effect of high speed handling
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[0032]Provided herein are techniques for high-speed precision handling of micro-chips for fan-out wafer-level packaging (FOWLP) and other heterogeneous integration applications. The term “micro-chip,” as used herein, refers to a chip with a substrate that is less than 100 micrometers (μm)×100 μm. For instance, radio-frequency identification (RFID) chips typically have substrate dimensions of about 40 μm×40 μm, and light-emitting diode (LED) chips typically have substrate dimensions of about 8 μm×8 μm. Thus, RFID and LED chips are considered herein to be micro-chips.
[0033]As will be described in detail below, the present techniques employ a precise laser and optical guide system to selectively place micro-chips on a thin, flexible substrate from a handle wafer. In one exemplary embodiment, a template wafer is employed to focus a (large spot size) laser beam precisely onto specific locations on the handle wafer to release single micro-chips from the handle wafer. In another exemplary ...
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