Efficient temperature forcing of semiconductor devices under test

Abstract

A temperature-forcing system and method for controlling the temperature of an electronic device under test comprises a temperature-forcing head, including a face positionable in thermal contact with the device, and an evaporator, in direct or indirect thermal contact with the face; and a refrigerant circulation subsystem, including a compressor, a condenser, a flow control device for inducing a pressure drop in the refrigerant, and a conduit circuit through which the refrigerant is flowable. The subsystem cooperates with the evaporator so as to define at least one closed loop through which a corresponding bi-phase refrigerant is circulatable, so that, during circulation, the refrigerant is maintained in a liquid phase between the compressor and the flow control device and in a gaseous phase while flowing through the evaporator. The temperature of the device is therefore switchable by the head at a rapid rate of 50 to 150 degrees Celsius per minute.

Description

[0001]The present application is a continuation-in-part of U.S. application Ser. No. 13 / 405,870 filed Feb. 27, 2012 and bearing the same title.FIELD OF THE INVENTION[0002]The present invention relates to temperature forcing of electronic components and, in particular, to temperature forcing of semiconductor chips and modules during testing.BACKGROUND OF THE INVENTION[0003]In the electronic components semiconductor industry it is generally required to subject prototypes and production samples of semiconductor devices (chips or modules) to thorough electrical testing. Since specifications of a device typically include the range of ambient temperatures over which it should be operable, each device under test (DUT), and more specifically its casing, must generally be held during part of such testing at each of the extreme temperature values of the specified range (thus simulating the required extreme ambient temperature values). Such extreme values are typically between 125 and 165 degr...

AI Technical Summary

Benefits of technology

The present invention provides a better way to cool electronic devices by using a bi-phase refrigerant which directly cools the device or a member in thermal contact with it, rather than using a single-phase transfer fluid. This results in greater thermal efficiency and faster device temperature switching. The system uses a refrigeration cycle with two stages of refrigerant and compressors to achieve a higher cooling effect. These improvements help to achieve lower device temperatures with less refrigeration and a smaller compressor. The system also allows for additional heating to control the temperature and includes heating elements to increase the temperature of the device.

Problems solved by technology

When testing at a high extreme temperature, however, the exothermic process of the DUT may at times be insufficient to raise its casing temperature to the desired level, as all of the generated heat is dissipated by the ambient air and external devices.

Such a prior-art system has three major drawbacks: (a) The presence of two heat exchangers in tandem causes a relatively large cumulative temperature differential between the chiller and the DUT, thus reducing the efficiency of the process and placing a sometimes unacceptable limit on how low the temperature of the latter may be forced with a simple (single-stage) refrigeration system.

(c) The relatively large heat capacity of the circulating transfer fluid further limits the rate at which the temperature may be switched.

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