Method and system for model-based design and layout of an integrated circuit

Abstract

A approach is described for allowing electronic design, verification, and optimization tools to implement very efficient approaches to allow the tools to directly address the effects of manufacturing processes, e.g., to identify and prevent problems caused by lithography processing. Fast models and pattern checking are employed to integrate lithography and manufacturing aware processes within EDA tools such as routers.

Description

CROSS REFERENCE TO RELATED APPLICATION(S)[0001]This application is a divisional application of U.S. patent application Ser. No. 12 / 133,563, filed on Jun. 5, 2008 and entitled “METHOD AND SYSTEM FOR MODEL-BASED DESIGN AND LAYOUT OF AN INTEGRATED CIRCUIT”. This application is also cross related to U.S. patent application Ser. No. ______, filed concurrently under Atty. Dkt. No. 07PA074US01D02 with the instant application and entitled “METHOD AND SYSTEM FOR MODEL-BASED DESIGN AND LAYOUT OF AN INTEGRATED CIRCUIT”. The content of both U.S. patent applications is hereby expressly incorporated by reference for its entirety for all purposes.BACKGROUND AND SUMMARY[0002]The invention is directed to a more efficient approach for hotspot detection, for implementing layout, and for placement, routing, and verification of integrated circuit designs.[0003]A semiconductor integrated circuit (IC) has a large number of electronic components, such as transistors, logic gates, diodes, wires, etc., that ...

AI Technical Summary

Benefits of technology

[0012]The problem with this approach is that lithography simulation and RET optimization is very resource intensive, requiring large quantities of both time and computing assets for adequate results. As the quantity of data in modern IC designs become larger and larger over time, the resources required for performing model-based verification and optimization upon these IC designs also becomes much greater. This problem is exacerbated by constantly improving IC manufacturing technologies that can create IC chips at ever-smaller feature sizes, which allows increasingly greater quantities of transistors to be placed within the same chip area, resulting in more complex physical and lithographic effects during manufacture.

[0013]To address these problems, among others, the present invention in some embodiments provides an approach for allowing EDA tools to implement very efficient approaches to allow the tools to directly address the effects of manufacturing processes, e.g., to identify and prevent problems caused by lithography processing. Fast models and pattern checking are employed to integrate lithography and manufacturing aware processes within EDA tools such as routers. In some embodiments, this approach avoids the rigid requirement of conventional tools that rely exclusively upon rule checks, avoiding the need to create overly complex rules that may or may not accurately reflect the real-world manufacturing problems that may occur to the design. This also avoids the need to hardcode the EDA tool (e.g., modify the router software) to explicitly target particular bad patterns, which significantly reduces or eliminates the need to perform this highly manual and error-prone effort. Moreover, this approach in some embodiments can also be used to avoid the very slow process of using external tools to verify the routed design and to provide feedback to the router. In this context, the external tool will often call the problems it finds “hotspots”.

Problems solved by technology

For example, optical distortions during the lithography process may cause variations in feature dimensions (e.g. line widths) that are patterned using masks.

However, certain IC design may actually need parameters that are more or less cautious than other designs.

Since DRC rules typically operate on an “all or nothing” basis, this means that many IC design may fail DRC processing even though they would function properly for intended purposes if manufactured.

Further, manufacturing an IC design has gotten steadily more difficult, so much so that certain 2D configurations of geometry may not function properly, even though they satisfy all the DRC rules.

As a result, the routed design may contain numerous layout portions that are problematic once manufacturing is performed, and would contribute to yield or functionality problems.

The problem with this approach is that lithography simulation and RET optimization is very resource intensive, requiring large quantities of both time and computing assets for adequate results.

This problem is exacerbated by constantly improving IC manufacturing technologies that can create IC chips at ever-smaller feature sizes, which allows increasingly greater quantities of transistors to be placed within the same chip area, resulting in more complex physical and lithographic effects during manufacture.

In this context, the external tool will often call the problems it finds “hotspots”.

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