Heating exchange chamber for liquid state cooling fluid

Abstract

A heat exchange chamber for liquid state cooling fluid is provided, which comprises a flow resistance, the flow resistance is sited inside a cavity at a position proximate to an inlet. In other words, the flow resistance is sited between the inlet and a thermal dissipation device. The flow resistance narrows down a flow channel from the inlet to the cavity, and it raises the resistance of the cooling fluid before the cooling fluid flows through a thermal dissipation device. Because of the heat exchange chamber for liquid state cooling fluid, the cooling fluid could be distributed uniformly through the dissipating heat device.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This non-provisional application claims priority under 35 U.S.C. § 119(a) on Patent Application No(s). 099136467 filed in Taiwan, R.O.C. on Oct. 26, 2010, the entire contents of which are hereby incorporated by reference.FIELD OF THE INVENTION[0002]The present invention relates to a heat dissipation module using cooling fluid, and more particularly, to a heat exchange chamber having a flow resistance disposed at a position proximate to the inlet of its cavity for narrowing down a flow channel from the inlet to the cavity so as to raise the resistance to the flow of the cooling fluid before the cooling fluid flows through a thermal dissipation device, and thus enable the cooling fluid to be distributed uniformly through the thermal dissipation device.BACKGROUND OF THE INVENTION[0003]In many typical mainframe computers such as servers, poor heat dissipation performance is usually the case that cause the computer to malfunction so that how t...

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Benefits of technology

[0006]In view of the disadvantages of prior art, the primary object of the present invention is to provide a heat exchange chamber capable of utilizing a flow resistance to raise resistance to the flowing of a cooling fluid and thus enabling the cooling fluid to be distributed uniformly inside a cavity formed inside a cavity of the heat exchange chamber.

[0007]To achieve the above object, the present invention provides a heat exchange chamber, comprising: a casing, configured with a cavity, an inlet and an outlet in a manner that the inlet is provided for allowing a cooling fluid to flow into the cavity and the outlet is provided for allowing the cooling fluid to flow out of the cavity as the cooling fluid is enabled to flow in a flowing direction through of the cavity; a thermal dissipation device, disposed inside the cavity; and a flow resistance, disposed inside the cavity at a position proximate to the inlet to be used for narrowing down a flow channel from the inlet to the cavity and thus raising the resistance to the flow of the cooling fluid before the cooling fluid flows through the thermal dissipation device, so as to enable the cooling fluid to be distributed uniformly through the thermal dissipation device.

Problems solved by technology

In many typical mainframe computers such as servers, poor heat dissipation performance is usually the case that cause the computer to malfunction so that how to design a heat sink or heat dissipating device with optimized heat dissipation performance is becoming the key issue in modern electronic computing industry.

And not to mention that the complexity of the heat dissipation system for modern cloud data centers that are crowded with servers in high density is generally almost double comparing with those for common data centers.

The results can be ugly if there is no proper heat dissipation system with good performance available and consequently all distinct possibilities can be caused, such as the operation of the servers may be unstable or even fail, energy can be wasted, the performance of the personnel working in the server room may be poor since an uncomfortable working environment can be resulted, the cost for managing the server room may increase, and so on.

Thereby, the heat dissipating efficiency can be severely affected since there must be a portion of the thermal dissipation device inside the heat exchange chamber that is sit idle as it is not in any thermal contact with the cooling fluid.

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