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Polyamic acid solution, polyimide resin and flexible metal clad laminate using the same

a technology of polyimide resin and polyimide resin, which is applied in the direction of pretreatment surfaces, plasma techniques, synthetic resin layered products, etc., can solve the problems of short circuit wiring, curling, and polyimide resin cannot exhibit its natural characteristics sufficiently, and achieve high adhesive strength

Active Publication Date: 2012-04-12
DOOSAN CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a polyimide resin layer that has high adhesive strength with respect to a bonding prepreg used for the preparation of a multilayer printed circuit board without deterioration of various properties such as flexibility, curling, heat resistance, chemical resistance, electrical characteristics. This is achieved by using a polyamic acid solution that includes specific amounts of aromatic tetracarboxylic acid dianhydride, pyromellitic dianhydride, at least one aromatic diamine, an organic solvent, and an inorganic filler. The invention also provides a flexible metal clad laminate and a printed circuit board that includes the polyimide resin layer. The method for preparing the flexible metal clad laminate includes coating the polyamic acid solution on a metal clad and heating it to form the polyimide resin layer.

Problems solved by technology

In the case of such a FCCL, the adhesive film is weak to heat, and under high temperature.high pressure environment, copper ions of the copper clad layer are moved into the adhesive film layer, thereby causing a short between circuit wirings.
Accordingly, the polyimide resin cannot sufficiently exhibit its natural characteristics such as high flexibility and heat resistance.
However, in the FCCL prepared by the cast method, curling occurs due to a difference in thermal expansion coefficients between the polyimide layer and the copper clad.
In a FCCL prepared by this method, it is possible to prevent the curling due to improvement of heat resistance or flexibility, but there is a problem in that the adhesive strength of the polyimide resin layer is decreased.
For this reason, it was difficult to adhere the FCCL to a bonding sheet (bonding prepreg) used for preparation of a multilayer flexible circuit board, thereby declining the applicability of the FCCL in the multilayer flexible PCB.

Method used

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  • Polyamic acid solution, polyimide resin and flexible metal clad laminate using the same
  • Polyamic acid solution, polyimide resin and flexible metal clad laminate using the same

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0058]1-1. Preparation of a Polyamic Acid Solution

[0059]Through a 4-neck reaction vessel provided with a thermometer, a stirrer, a nitrogen inlet and a powder dispensing funnel, nitrogen gas was slowly passed, while 166 ml of N-methyl pyrrolidone (NMP) and 6.8 g (20 wt %) of talc powder were added, followed by stirring. To the solution, 7.11 g (0.0657 mol) of p-phenylenediamine (p-PDA) and 3.32 g (0.0166 mol) of 4,4′-oxydianiline (ODA) were added, and the resultant mixture was completely dissolved by being stirred at 25° C. To the resultant solution, 21.77 g (0.0740 mol) of 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride (BPDA) and 1.79 g (0.0082 mol) of pyromellitic dianhydride (PMDA) were slowly added, and the mixture was polymerized by being stirred for 10 hours so as to provide a polyamic acid solution having a viscosity of 25,000 cps.

[0060]1-2. Fabrication of Flexible Copper Clad Laminate

[0061]By using a casting method, the prepared polyamic acid solution was coated on the s...

example 2

[0062]By using an atmospheric plasma generator, on the surface of the polyimide layer of the flexible copper clad laminate obtained from Example 1-2, atmospheric plasma treatment was carried out.

[0063]

[0064]gas: argon gas, oxygen gas, nitrogen gas

[0065]strength of plasma: 7 kV

[0066]distance between an electrode and a polyimide layer: 5 mm

[0067]treatment speed: 1 m / min

example 3

[EXAMPLE 3] TO [EXAMPLE 8], AND [COMPARATIVE EXAMPLE 1] TO [COMPARATIVE EXAMPLE 7]

[0068]As noted in Tables 1 and 2 below, a polyamic acid solution and a flexible copper clad laminate were prepared in the same manner as described in Example 2, except that the contents of p-phenylenediamine (p-PDA), 4,4′-oxydianiline (ODA), 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride (BPDA), pyromellitic dianhydride (PMDA), and talc were changed.

TABLE 1Exp 1Exp 2Exp 3Exp 4Exp 5Exp 6Exp 7Exp 8BPDAAmount (g)21.7721.7720.7520.5219.6517.5812.913.065Mol0.07400.07400.07050.06970.06680.05980.04380.044PMDAAmount (g)1.791.792.712.682.575.599.569.68Mol0.00820.00820.01240.01230.01180.02560.04380.0444PMDA / (BPDA + PMDA)0.100.100.150.150.150.300.500.50p-PDAAmount (g)7.117.117.186.664.677.387.117.68Mol0.06570.06570.06640.06160.04320.06820.06570.0710ODAAmount (g)3.323.323.364.147.113.454.423.59Mol0.01660.01660.01680.02070.03550.01720.02210.0179p-PDA / (p-PDA + ODA)0.800.800.800.750.550.800.750.80Diamine / Dianhydr...

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Abstract

Disclosed are a polyamic acid solution, a polyimide resin prepared by imidization of the polyamic acid solution, a flexible metal clad laminate using the polyimide resin, and a printed circuit board including the flexible metal clad laminate, wherein the polyamic acid solution includes (a) 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride (BPDA), and pyromellitic dianhydride (PMDA) as aromatic tetracarboxylic acid dianhydride; (b) at least one aromatic diamine; (c) an organic solvent; and (d) an inorganic filler.

Description

TECHNICAL FIELD[0001]The present invention relates to a polyamic acid solution, a polyimide resin for preparing a flexible metal clad laminate, the flexible metal clad laminate using the polyimide resin, and a printed circuit board including the flexible metal clad laminate, in which the polyimide resin is prepared by the polyamic acid solution and has an improved adhesive strength with respect to a bonding prepreg.BACKGROUND ART[0002]A flexible copper clad laminate (FCCL) is mainly used as a substrate for a flexible printed circuit board (FPCB), and also used for a surface heating element electromagnetic wave shielding material, a flat cable, a packaging material, and the like. As an electronic device employing a PCB has recently gradually become small-sized, highly densified, and highly effective, the use of a FCCL has been further increased.[0003]The FCCL includes a polyimide layer and a copper clad layer. Such a FCCL is prepared by laminating a copper clad layer onto a polyimide...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H05K1/00C08K3/34C08K3/26C08K3/10C08K3/22B05D3/04C08K3/40C08L63/00B32B15/08B32B27/38B05D3/02C08L79/08C08K3/36
CPCB32B2457/08H05K2201/0154H05K2203/0759B32B27/38H05K2201/0355C08G73/1067C08G73/1042C08L79/08Y10T428/10B32B27/20B32B15/08H05K2201/0209Y10T428/251H05K1/0346C08K3/0033C08K3/013C09K2323/00Y10T428/31529Y10T428/3154Y10T428/31681Y10T428/31721Y10T428/31725C08K3/00C08K5/1539
Inventor KIM, YANG SEOBKIM, WON KYUMKIM, HYUNG WANYANG, DONG BO
Owner DOOSAN CORP
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