Method for manufacturing a droplet discharge head
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first modified example
[0093]In place of “removing the remnant membrane RF (forming the through holes H) by the laser processing” in the head-body-before-fired forming step included in the manufacturing method described above, the remnant membrane RF may be removed by a precision polishing after the compact-after-dried 110 is fired. That is, the remnant membrane RF may be removed by a polishing processing after the compact 110 is fired. This enables to precisely adjust a diameter of each of the tip portion (portion of the opening, droplet discharge opening) of the nozzle sections 21b, and therefore, the nozzle plate (discharge hole tip portion forming member) which is another member (e.g., SUS, or the like) may not need to be used.
second modified example
[0094]In place of “removing the remnant membrane RF (forming the through holes H) by the laser processing” in the head-body-before-fired forming step included in the manufacturing method described above, the remnant membrane RF may be removed (eliminated) by a polishing as shown in FIG. 9, after the slurry SL is dried and solidified, and therefore, the compact-after-dried 110 is formed between “the mold 100 and the porous plate 120” (refer to FIG. 4), and before the mold 100 is released from the compact-after-dried 110 (i.e., before demolding). That is, the compact-after-dried 110 may be polished while the compact-after-dried 110 is maintained (held) in the mold 100 to form the through holes H (refer to FIG. 10).
[0095]More specifically, this polishing is performed as follows.
[0096]Firstly, when the compact-after-dried 110 has been formed in the mold 100 as shown in FIG. 4, the compact-after-dried 110 is released / separated from the porous plate 120 while the compact-after-dried 110 i...
third modified example
[0103]In place of “removing the remnant membrane RF (forming the through holes H) by the laser processing” in the head-body-before-fired forming step included in the manufacturing method described above, the remnant membrane RF may be removed (through holes H are formed) by a “special blast processing using elastic grains (described later)” after the compact-after-dried 110 is fired, to thereby complete the nozzle sections 21b.
[0104]More specifically, in the third modified example, “the ceramic green sheet to be the vibration plate 30 and the ceramic green sheet to be the liquid storage chamber cover member 40” are layered (stacked) on the compact-after-dried 110 from which the remnant membrane RF has not been removed yet, while aligning them in a planar direction. Subsequently, these are joined by a thermal compression bonding, and the thermal compression bonded layered body is fired after it is degreased. As a result, the head body-after-fired 20B (droplet discharge head body-bef...
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Abstract
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