Methods and apparatus for recovery of silicon and silicon carbide from spent wafer-sawing slurry
a technology of wafer cutting and recovery method, which is applied in the direction of separation process, furnace, other chemical processes, etc., can solve the problems of reducing the content of steel, reducing the efficiency of the value chain, and losing around 40-50% of the silicon during the wafer cutting process, so as to reduce the content of steel.
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[0050]Two replicate experiments were performed in a bench-scale process system. The conditions used with apparatus (Reactor 1 and Reactor 2) in FIGS. 1 and 2 for Runs S1-31-08-11-14 and S1-31-08-12-05 are listed in Table 1 below.
TABLE 1Run S1-31-08-11-14Run S1-31-08-12-05Raw materials used inHigh purity iodine andHigh purity iodine andSiI4 productionsilicon wafer piecessilicon wafer piecesSi Source materialTreated industrial kerfTreated industrial kerf(Reactor 1)beadsbeadsDeposition zone bedQuartz slidesQuartz slidesmaterial (Reactor 2)Reactor 1 (° C.)12001200Reactor 2 (° C.) 900 900Carrier gasArgonArgon
[0051]Kerf raw material from an industrial source was subjected to a series of steps including magnetic separation, leaching, solid / liquid separation, and drying. Table 2 shows a comparison of the composition difference between Stream 1 and 7 in FIG. 1 using GDMS analysis. The Boron and Phosphorous composition of silicon product is given in Table 3. Finally, a representative sample o...
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