Isothermal Plate Module

Abstract

An isothermal plate module includes an isothermal plate body and a plurality of heat pipes. One surface of the isothermal plate body has first recesses extending along a first direction and second recesses extending along a second direction. The first recesses extending along the first direction and the second recesses extending along the second direction are staggered to one another. A level difference is formed between each first and second recess. The heat pipes can be disposed in the first recesses and the second recesses, respectively. The isothermal plate body adheres to the heat source. With the plurality of staggered heat pipes and the working fluid and capillary structure within the heat pipes, an isothermal plate module can be formed.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a structure of an isothermal plate module, and in particular to a structure planarly provided on a heat source element. Further, a plurality of heat pipes having different orientations and levels are disposed in the isothermal plate, thereby to efficiently increase the heat-dissipating coefficient and the heat-dissipating efficiency.[0003]2. Description of Prior Art[0004]Taiwan Patent Publication No. 510961 entitled “Method for manufacturing heat-dissipating plate and heat pipe” discloses a procedure comprising the steps of: processing a heat-dissipating plate, providing a plurality of heat-conducting passages with their distal ends un-penetrated, sealing the open end of each heat-conducting passage and keeping at least one opening, filling the open end with working fluid and performing a vacuum treatment to the kept open end, and sealing the kept open end. The object of said patent docu...

AI Technical Summary

Benefits of technology

[0008]The present invention is to provide an isothermal plate module comprising a plurality of recesses with different orientations and levels. A plurality of heat pipes is provided in the recesses to increase the heat-dissipating coefficient and improve the heat-dissipating efficiency. As a result, a device that is light in weight, simple in structure, large in the heat-conducting distance and is not restricted by the gravity and needs no additional external power can be obtained.

[0010]Still another, the present invention is to provide an isothermal plate having a large area. Since the density of heat generation of many electronic apparatuses is very high, for example, a LED back light module displayer employs LEDs to be the light source of the displayer, and thus a heat-dissipating member having a large area is necessary. In the manufacture of the present invention, only one end face is provided with recesses and the heat pipes are disposed in the recesses to form the isothermal plate module. Therefore, the manufacture is easy and can be applied to the mass production of electronic products having large area. Further, the present invention provides a perfect effect of heat conduction.

Problems solved by technology

No matter whether the heat-dissipating plate and heat pipe finally formed in Taiwan Patent Publication No. 510961 has efficiently achieved heat dissipation, the processing procedure indeed has some difficulty in practice.

When the angle of initial processing is slightly deviated, the whole passage will oblique, resulting in the bad products (such as the collapse of the surface of the heat dissipating plate).

Further, since there is a lot of heat-conducting passages, the possibility of error may be relatively increased, resulting in the poor practicability of mass production.

Moreover, penetrating through the heat-conducting passages by means of the processing procedure can be only carried out on a heat-conducting plate having small area.

As to the area of the heat-dissipating plate necessary for a back light module of a 14″ liquid crystal screen, the above kind of processing procedure is very unsuitable.

However, the gap is located on the end contacting with the heat source, so that the heat pipe cannot directly contact with the heat source and thus the heat-conducting effect is deteriorated.

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