Precoat composition for organic solderability preservative

a preservative and organic technology, applied in the field of organic solderability preservative process, can solve the problems of reducing the conductivity of the gold contact surface, and achieve the effect of enhancing the solderability of the copper surfa

Inactive Publication Date: 2007-09-27
MACDERMID INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0019] It is an object of the present invention to provide an improved OSP coating process that uses a pretreatment composition prior to the OSP coating.
[0020] It is another object of the present invention to use the improved OSP coating process of the invention to prepare electronic components such as printed wiring boards.
[0021] To that end, the present invention is directed to a method of enh...

Problems solved by technology

The pretreatment coating described by Wengenroth is believed to preserve the solderability of the copper surface while substantially excluding gold surfa...

Method used

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Embodiment Construction

[0024] The present invention is directed to an improved protective coating system for coating copper metallurgy on printed wiring boards (PWB's) including copper pads and through holes.

[0025] In the present invention, a conventional azole-based OSP coating is improved by using a pre-treatment step, wherein the copper surfaces are contacted with a pre-treatment solution comprising an aliphatic carboxylic acid and preferably an amine before the OSP treatment. The inventors of the present invention have found that the use of the pretreatment composition of the invention enhances the final protective coating on the copper surfaces and provides a more uniform coating that also has a better appearance and color.

[0026] More particularly, the present invention is directed to a method of enhancing the solderability of a copper surface comprising the steps of:

[0027] a) contacting one or more copper surfaces with a pretreatment composition comprising a dilute solution of an aliphatic carbox...

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Abstract

An improved method of enhancing the solderability of a copper surface comprising the steps of contacting one or more copper surfaces with a pretreatment composition comprising a dilute solution of an aliphatic carboxylic acid and an additive selected from the group consisting of amines and ammonia and thereafter contacting the one or more surfaces with an organic solderability preservative composition. The improved organic solderability preservative process of the invention forms a more uniform coating that has a better appearance and color.

Description

FIELD OF THE INVENTION [0001] The present invention is directed to an organic solderability preservative process for coating copper circuitry during printed wiring board manufacture. The improved process of the invention comprises the use of a pre-coat coating prior to the main organic solderability preservative bath to enhance solderability of the copper surfaces. BACKGROUND OF THE INVENTION [0002] In the manufacture of printed wiring boards (PWB) having metal containing components which are to be soldered, it is necessary to protect the metal from oxidation to enhance its solderability. Typically, many such electronic components have copper circuitry thereon and may also have gold leads or other electrical connections which are generally used to connect the electronic component to other electronic components. [0003] Processes currently used to protect copper prior to soldering typically employ a protective coating deposited on the copper. Prior art processes include hot air solder...

Claims

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Application Information

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IPC IPC(8): C25D5/54
CPCC23F11/10C23F11/126H05K2203/124H05K3/282H05K2203/0392C23F11/149
Inventor LARSON, BRIANPAW, WITOLD
Owner MACDERMID INC
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