Method and system for managing, analyzing and automating data in the production of semiconductor wafers and for monitoring the production process
a technology of semiconductor wafers and data, applied in the field of material processing, can solve the problems of not including data from surface inspection systems such as defect evaluation systems, defect evaluation systems were developed, and the management, analysis and automation of wafer data became extremely complicated, so as to improve the use of metrology and inspection tools, reduce the impact of excursion on work in progress, and eliminate paper based quality records
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[0074] As seen in FIG. 1, the present invention comprises a data acquisition system 00 for acquiring semiconductor wafer scan data from metrology and inspection tools such as wafer dimensional scanning tool 10, device inspection tool 12 and nanotopography tool 14. Each tool communicates with data acquisition system 00 using its own communications or interface protocol, over a communications path 18a. Data acquisition system 00, in turn, communicates over a communications path 18 with buffer system 02. Buffer system 02 provides temporary storage 16 for scan data transmitted from the wafer scanning tools and also provides fault tolerance features. Still in FIG. 1, buffer system 02 transmits data to server system 04 over communications path 18. Server system 04 provides storage for scan data transmitted by buffer system 02 in a database management system 08. Server system 04 converts the scan data into a format used by data management system 08.
[0075] Still in FIG. 1, server system 04...
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