Adaptive lithographic critical dimension enhancement
a critical dimension and enhancement technology, applied in the field of lithographic system and method of lithographic exposure, can solve the problems of loss of yield, cd uniformity, affecting critical dimension uniformity, etc., and achieve the effect of improving cd uniformity
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[0033] As noted above, processes that treat the substrate wafers contribute to variations in CDU that negatively affect the quality and performance of the exposed patterns. Such non-uniformities may occur across a target field, across a wafer, and between wafers. Moreover, these non-uniformities can also vary depending a variety of factors, such as the particular path the substrate wafer travels, scheduling anomalies, etc. As described in greater detail below, the present invention contemplates a lithographic system that employs an adaptive CD enhancement process whereby these variations and non-uniformities are factored out to provide acceptable CDU levels. Such a process exploits information regarding the lithographic system, for example, wafer track processing data, metrology data, and / or substrate wafer history data, to iteratively arrive at and maintain the optimal corrective dose offsets that improve overall CDU performance.
[0034]FIG. 1A schematically depicts lithographic sys...
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