Biocides for polishing slurries

Inactive Publication Date: 2002-02-28
RONDEL HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0006] It has been found that a five membered organic ring compound containing both a sulfur and a nitrogen in the ring provide biocide protection of CMP slurries without affecting polishing performance. Examples of such compounds are 5-chloro-2-methyl-4-isothiazolin-3-one and 2-methyl-4-isothiazolin-3-one.

Problems solved by technology

It has been found in recent years that the above chemicals are not always compatible with abrasive slurries used for chemical-mechanical polishing (CMP) of semiconductor wafers and with abrasive free slurries used with fixed abrasive polishing pads for semiconductor wafer polishing.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 2

[0010] A polishing slurry comprising as major components iodic acid, lactic acid, potassium hydrogen phthalate, and metal oxide abrasive (a mixture of alumina and titania) was made up as slurry A. To a portion of this slurry was added 0.10% by weight of Kathon.RTM. CGICP biocide (active ingredients 2-methyl-4-isothiazolin-3-one and 5-chloro-2-methyl-4-isothiazolin-3-one). This slurry was designated slurry B.

[0011] Wafers comprising tungsten (W), titanium (Ti), and silicon dioxide (Ox) were polished on a standard CMP polishing machine using slurry A and slurry B. Results of the polishing are shown in Table 3.

3 TABLE 3 Avg. W RR Avg. Ti RR Avg. Ox RR Slurry Angstroms / min Angstroms / min Angstroms / min A 3392 545 65 B 3533 564 64 B 3565 889 105 A 3291 891 62

example 3

[0012] A CMP slurry was made up with the following major components: Klebosol 1498-50 (silica sol), citric acid (complexing agent), benzotriazol (corrosion inhibitor), and a surfactant. Addition of a small amount (about 0.1%) of Neolone.RTM. (available from Rohm and Haas Company) gave adequate biocide protection to the CMP slurry while the slurry provided slightly improved surface quality when the slurry was used as a second step slurry for polishing semiconductor wafers comprising copper.

[0013] It is obvious from the above results that the addition of a biocide comprised of 2-methyl-4-isothiazolin-3-one and / or 5-chloro-2-methyl-4-iso-thiazolin-3-one in an amount sufficient to provide antibacterial and antifungal protection to the slurry does not adversely affect the polishing performance of a slurry. It performs particularly well on slurries which comprise Klebosol.RTM. silica sol as an ingredient. A sufficient amount of biocide is in the range of 0.01% to 1% by weight of the CMP s...

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Abstract

Compounds containing both a sulfur and a nitrogen in a five-membered ring structure are used as biocides in polishing solutions and slurries.

Description

[0001] This application claims the benefit of U.S. Provisional Patent Application Ser. No. 60 / 182,960 filed Feb. 16, 2000.[0002] This invention relates to the protection of polishing slurries and silica dispersions from the proliferation of bacteria and / or fungi by means of biocides.DESCRIPTION OF RELATED ART[0003] The problem of bacterial and fungal growth in silica polishing slurries is addressed in U.S. Pat. No. 5,230,833 (Romberger et al.). It includes a thorough summary of the early related art. Bactericides disclosed in '833 are tetramethylammonium chloride, tetraethylammonium chloride, tetrapropylammonium chloride, alkylbenzyldimethylammonium chloride, and alkylbenzyldimethylammonium hydroxide, wherein the alkyl chaim ranges from 1 to about 20 carbon atoms. Also, the preferred biocide is sodium chlorite or sodium hypochlorite. The preferred fungicide is sodium OMADINE.RTM. (pyrithone).[0004] U.S. Pat. No. 3,377,275 discloses a synergistic blend of 3,5-di-methyl tetrahydro 1,3...

Claims

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Application Information

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IPC IPC(8): C09G1/02C09K3/14
CPCC09G1/02C09K3/1463
Inventor LUO, QIULIANGGOLDBERG, WENDY B.
Owner RONDEL HLDG
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