Solder bump forming method and apparatus
a technology of soldering method and forming method, which is applied in the direction of soldering apparatus, manufacturing tools,auxillary welding devices, etc., can solve the problems of increased production cost, prolonged adjustment operation of positioning time, and inability to use methods that have not been widely used, so as to eliminate the limitation on the type of target substrate and be easily separated
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[0061] A eutectic solder was used, and a substrate was spaced 25 .mu.m from the flange portion and 55 .mu.m from the height regulator. The pressure of the gas was 150 gf / cm.sup.2. With this arrangement, bumps each having a height of 65 .mu.m were formed on 140-.mu.m diameter pads. The processing time was only about 5 to 10 seconds for each flip-chip pattern. This was possible because the formation of barrel-shaped solder melt fractions and the separation thereof from the chamber were carried out at a relatively high speed.
[0062] While there have been shown and described what are at present the preferred embodiments of the invention, it will be obvious to those skilled in the art that various changes and modifications may be made therein without departing from the scope of the invention as defined by the appended claims.
[0063] In the apparatus and method according to the present invention, the container-forming member assembly and the substrate having target pads thereon may be moved...
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