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Lead-free soldering tin crease and its production

A lead-free solder paste, lead-free solder technology, applied in welding equipment, welding media, manufacturing tools, etc., can solve the problems of gap, high cost, difficult operation, etc., and achieve high welding strength, low preparation cost, and void defects. reduced effect

Inactive Publication Date: 2007-06-20
梁树华
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, it is proposed to coat a layer of inert metals that are not easily oxidized on the surface of solder powder particles, such as Au, Ni, etc., but this method is expensive and difficult to operate; There is still a large gap in reaching the satisfactory state

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Component M. Prepare the Sn-Zn-based lead-free alloy solder powder formulated according to the following mass percentages: Sn-8.5Zn-1.5Bi (that is, Zn accounts for 8.5% and Bi accounts for 8.5% in the Sn-Zn-based lead-free alloy solder powder. 1.5%, the rest is Sn), the particle size range is 25-45μm, and the weight is 44.5kg.

[0022] Component P. Preparation of a buffer-protective activating cream layer: 900 g of carbitol, 495 g of hydrogenated rosin, and 105 g of 3-hydroxy-4-methylbenzoic acid were uniformly mixed under heating conditions. The total weight of the mixture is 1500 g.

[0023] Component F. Self-made lead-free solder paste flux: 400g of salicylic acid, 1600g of dioctyl phthalate and 2000g of natural rosin resin were heated and mixed evenly to obtain a total mixture of 4000g.

[0024] Mix the total amount of component M with the entire total amount of component P in a special sealed container, and simultaneously evacuate. The stirring speed was set at 1...

Embodiment 2

[0026] The preparation process is the same as in Example 1. Only the substance and content of each component change to the following:

[0027] Component M: Sn-9Zn based Sn-Zn-based lead-free alloy solder powder (that is, Zn accounts for 9.0% of the Sn-Zn-based lead-free alloy solder powder, and the rest is Sn), diameter range: 25-45μm, weight 44kg .

[0028] Component P: 880g butyl cellosolve, 520g polymerized rosin resin, 100g dihydroxyphenylacetic acid.

[0029] Component F: Same as Example 1.

Embodiment 3

[0031] The preparation process is the same as in Example 1, but the material and content of each component change to as follows:

[0032] Component M: Sn-Zn-based lead-free alloy solder powder is Sn-7.5Zn-1.0Bi (that is, in Sn-Zn-based lead-free alloy solder powder, Zn accounts for 7.5%, Bi accounts for 1.0%, and the rest is Sn), grain Diameter range: 25~45μm, weight 44kg.

[0033] Component P: 850 g propylene glycol monophenyl ether, 135 g acrylic resin, 400 g hydrogenated rosin resin, 150 g dihydroxycinnamic acid.

[0034] Component F: 380 g of succinic acid, 100 g of adipic acid, 1500 g of dibutyl phthalate, and 2000 g of hydrogenated rosin resin.

[0035] The change of each component is mainly adjusted according to the actual requirements of different electrical circuit boards and the change of the alloy solder powder composition, in order to obtain the best comprehensive performance.

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Abstract

A non-lead tin solder cream with high storage stability, wetting power for soldering, heat shock resistance, and solder strength is proportionally prepared from Sn-Zn based non-lead alloy powder, flux and protective activated film layer containing neutral organic solvent with high boiling point, neutral resin and activating agent with high decomposing temp through mixing and grinding said alloy powder with the raw materials of said activated film in vacuum, adding flux, and stirring.

Description

technical field [0001] The invention relates to a solder paste and a preparation method thereof, in particular to a lead-free solder paste for microelectronic welding and a preparation method thereof. Background technique [0002] Due to human society's emphasis on environmental protection, it is imperative to control substances harmful to health such as lead, cadmium, and mercury. In microelectronic soldering, the application of lead-free solder has been officially launched. Lead-free solder paste is an important material in microelectronic packaging. Among the lead-free solder paste products with application value, Sn-Ag-Cu and Sn-Bi series are more widely used. But they have their own disadvantages. For example, the cost of Sn-Ag-Cu series solder paste is too high, and the melting point temperature is above 220°C, which puts higher requirements on electronic components and welding equipment of electronic product circuit boards. Coupled with the lack of Ag resources, it...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/24B22F1/02
Inventor 梁树华周厚玉
Owner 梁树华
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