Heat transfer apparatus, cooled electronic module and fabrication methods thereof
An electronic module and cooled technology, applied in cooling/ventilation/heating transformation, instrument cooling, circuit, etc., can solve problems such as interface thermal resistance
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[0034] As used herein, "electronic equipment" includes any heat-generating electronic component of a computer system or other electronic system that requires cooling. In one example, an electronic device includes an integrated circuit chip. The term "cooled electronic module" includes any electronic module with a cooling function and at least one electronic device, and both single-chip modules and multi-chip modules are examples of electronic modules to be cooled. As used herein, "micro cooling structure" refers to a cooling structure with a feature size of 200 microns or less. A "composite" fin structure refers to any fin in which a first material having a first thermal conductivity is coated or wrapped with a second material having a second thermal conductivity. Each "material" may be a thermally conductive element or compound.
[0035] In general, there is provided an improved cooling device and method of making the same, which uses direct or indirect liquid coolant metho...
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