Radiator
A technology of radiator and heat dissipation fin, applied in the direction of instruments, electric solid-state devices, semiconductor devices, etc., can solve the problems of inconvenience and trouble in production, and achieve the effect of stable fastening
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[0013] Please refer to Fig. 1 to Fig. 3, in the first embodiment of the present invention, the radiator 1 includes a plurality of heat dissipation fins 10 stacked on top of each other, the radiator 1 can be directly attached to the surface of the heating element (not shown), It can be pasted on a heat conduction plate (not shown in the figure), and then contact the heating element through the heat conduction plate.
[0014] As shown in FIGS. 2 to 4 , each heat dissipation fin 10 has a flat heat dissipation body 14 , and the upper and lower edges of the body 14 are respectively bent and extended in the same direction with a folded edge 16 . Each flange 16 includes a receiving portion 162 extending along the edge of the main body 14 , a connecting portion 163 extending along the end of the receiving portion 162 , and a fastening portion extending from the free end of the connecting portion 163 parallel to the receiving portion 162 164. The connecting portion 163 is inclined to ...
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Abstract
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