Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Workpiece processing system

A workpiece and processing chamber technology, applied in the field of workpiece processing machines and systems for processing semiconductor workpieces, can solve problems such as insufficient particle specifications, and achieve the effects of stable wafer processing, reduced particle pollution, and improved production pass rate.

Inactive Publication Date: 2007-04-04
APPLIED MATERIALS INC
View PDF3 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing machinery is insufficient to meet future particle specifications

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Workpiece processing system
  • Workpiece processing system
  • Workpiece processing system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0075] Description with reference to Figures 1 to 3

[0076] As shown in FIGS. 1-3 , processing system 10 has housing 15 , controller / display 17 , and input / output station 19 and a plurality of processing stations 14 . Workpieces 24 are removed from carriers 21 at input / output station 19 and processed within system 10 .

[0077] The processing system 10 includes a support structure for a plurality of processing stations 14 within an enclosure 15 . At least one handling station 14 includes a workpiece handling machine 16 and an actuator 13 for opening and closing the handling machine 16 . The processor 16 of the present invention is designed for use in processing systems 10, such as those filed on June 6, 2003, Application Nos. 691,688, and the processing system disclosed in co-pending US Patent Application No. 10 / 690,864, filed October 21, 2003. These US patent applications are hereby incorporated by reference. System 10 may include only a plurality of processors 16, or ma...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A system for processing a workpiece includes a process head assembly and a base assembly. The process head assembly has a process head and an upper rotor. The base assembly has a base and a lower rotor. The base and lower rotor have magnets wherein the upper rotor is engageable with the lower rotor via a magnetic force created by the magnets. The engaged upper and lower rotors form a process chamber where a semiconductor wafer is positioned for processing. Process fluids for treating the workpiece are introduced into the process chamber, optionally while the processing head spins the workpiece. Additionally, air flow around and through the process chamber is managed to reduce particle adders on the workpiece.

Description

technical field [0001] The present invention relates to the surface treatment, cleaning, rinsing and drying of workpieces, such as semiconductor wafers, flat panel displays, hard disk or optical media, thin film magnetic heads, or other workpieces formed from substrates on which microelectronic circuits, data storage elements or layers, or micromechanical components. These and similar articles are collectively referred to herein as wafers or workpieces. In particular, the present invention relates to a workpiece handler and system for processing semiconductor workpieces. Background technique [0002] The semiconductor manufacturing industry is constantly seeking to improve the processes and machinery used to fabricate microelectronic circuits and components, such as integrated circuits from wafers. The goals of most of these improved processing techniques and machinery include: reducing the time required to process wafers to form the desired integrated circuits; increasing...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/00B05C11/00
Inventor 凯尔·M·汉森埃里克·伦德科比·格罗夫史蒂文·L·皮斯保罗·Z·沃思斯科特·A·布鲁纳乔纳森·孔茨
Owner APPLIED MATERIALS INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com