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High flexible copper-clad laminate manufacturing method

A manufacturing method and technology of laminates, which are applied in the directions of printed circuit manufacturing, chemical instruments and methods, lamination, etc., can solve the problems of poor transportability and the like

Active Publication Date: 2007-01-31
NIPPON STEEL CHEM &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Furthermore, there is also the problem of poor transportability due to creases caused by heat shrinkage of the copper foil.

Method used

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  • High flexible copper-clad laminate manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

Synthetic example 2

Embodiment 1

[0031] An electrolytic copper foil 1 with a thickness of 12 μm (HL foil manufactured by Nippon Electrolytic Co., Ltd., average crystal particle diameter before heat treatment: 1.0 μm) was prepared. The polyimide precursor resin solution b prepared in Synthesis Example 2 was uniformly coated on the copper foil so that the thickness after curing was about 2 μm, and then heated and dried at 130° C. to remove molten coal. Next, the polyimide resin precursor solution a prepared in Synthesis Example 1 was uniformly coated thereon in a layered manner so that the thickness after curing was about 20 μm, and the solvent was heated and dried at 135°C to remove the solvent. Then, the polyimide resin precursor solution b was uniformly coated on the polyimide layer so that the thickness after curing was about 3 μm, and the solvent was heated and dried at 130° C. to remove the solvent.

[0032] This laminate was then subjected to a heat treatment step of gradually increasing the temperature at 1...

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Abstract

This invention provides a method for stably making a flexible copperclad laminate board which exhibits excellent anti-flexion property, the flexible copper clad laminate board being made from a copper foil and a polyimide resin layer. The method for making a copper cladlaminate board composed of a copper foil and a polyimide resin layer comprises the steps of coating a surface of the copper foil with a solution of polyimide precursor resin, performing a drying and hardening process in a subsequent heat treatment process, wherein an electrolytic copper foil is used for the copper foil, and the coated copper foil is held under the temperature of 300 ~ 450 DEG C for 5 to 40 minutes, to grow the copper crystalline particles up to an average crystalline particle diameter of the copper foil two(2)to eight(8) times of that before the heat treatment process.

Description

Technical field [0001] The present invention relates to a method for manufacturing a flexible copper-clad laminate (hereinafter referred to as a copper-clad laminate) for use in electronic equipment, and particularly relates to a method for manufacturing a high-bending flexible copper-clad laminate with excellent high bending properties. Background technique [0002] Flexible copper clad laminates are widely used in moving parts in hard disks or hinge parts of mobile phones, etc., in electronic devices that require flexibility or flexibility and high-density assembly. In recent years, with the progress of smaller and higher-level devices, the number of cases in which copper-clad laminates are folded and stored in narrow spaces has increased. Since the bending angle of the copper-clad laminate itself has also become an acute angle, Therefore, it is indispensable to supply copper clad laminates with higher flexibility. [0003] Under this background, a method of improving the flexi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00C22C9/00C22F1/08C25D1/04
CPCB32B15/08B32B15/20B32B27/281B32B37/0038
Inventor 福田夏树服部公一
Owner NIPPON STEEL CHEM &MATERIAL CO LTD
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