Etching solution, method of etching and printed wiring board

Abstract

The invention discloses an etching solution, which is obtained by adding a high-concentration triazole compound capable of forming a film with an etching-inhibiting effect to a copper chloride solution. In the process of forming a circuit pattern by etching using this etchant, an etching inhibiting film is selectively formed on a part of the copper foil located below the etching resist from the edge of the etching resist, thereby effectively preventing The side etching of the copper foil occurs in the horizontal direction at the edge of the etching resist. In addition, non-uniform fine unevenness is formed on the side wall of the circuit pattern formed by the etching process, thereby improving the adhesion between the circuit pattern and the resin insulating layer covering the circuit pattern.

Description

Technical field [0001] The present invention relates to an etching solution used in the etching process of circuit wiring using copper as a material, and relates to the addition of an additive containing a component capable of forming a film having an etching inhibitory effect, even in the processing of metal materials such as copper. Among them, an anisotropic etching (high etching coefficient) etching solution, an etching method using the etching solution, and a printed circuit board having a wiring pattern formed by the etching method can also be performed. Background technique [0002] At present, the development of the field of electronic equipment is amazing. In the printed circuit board industry, there is a strong demand for low-cost supply of high-density circuit boards. However, in the conventional subtractive method (cap via method), the formation of the circuit pattern by etching is isotropic, and it is difficult to impart directionality to the etching. Therefore, ther...

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Problems solved by technology

[0010] However, although the above-mentioned literature discloses additives for suppressing side etching in the etching process using copper chloride or ferric chloride etching solution, even if the additive with the best effect is selected, only the same as the existing one can be obtained. Compared with the suppression effect of about 30% by some etching methods, there is a problem that sufficient suppression effect cannot be obtained in the manufacture of high-density wiring

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