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Process for the preparation of cubic boron nitride material

A cubic boron nitride and composite material technology, applied in metal material coating process, coating, heating inorganic powder coating and other directions, can solve the problem of high cost of cubic boron nitride products, difficult to meet the use of cubic boron nitride, Low working temperature and other problems, to achieve the effect of low manufacturing cost, cost reduction, wear resistance and metallurgical bonding strength improvement

Inactive Publication Date: 2006-12-27
JILIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Silver-based solder has a low melting point and good process performance, but the cost of cubic boron nitride products brazed with silver-based solder is high, and the working temperature is low (400 ° C), it is difficult to meet the requirements of cubic boron nitride itself as a high-temperature wear-resistant material. usage of

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] The pure Cu, Ti and Sn metal powders with a particle size of 20-200 meshes are uniformly mixed according to the following proportions as alloy solder: Ti 5Wt%, Sn 6Wt%, Cu 89Wt%; then 70Wt% cubic boron nitride and The alloy solder of 30Wt% and the binding agent (polystyrene and three After the mixture of vinyl chloride) is fully mixed and uniform, it is coated on the surface of the steel substrate, and after being heated by vacuum brazing, a cubic boron nitride wear-resistant composite layer is formed on the surface of the substrate steel. The bonding strength between the composite layer and the matrix is ​​128Mpa.

Embodiment 2

[0021] The composition of alloy solder is: Ti 5Wt%, Sn 6Wt%, Cu 89Wt%; the mixing ratio of cubic boron nitride and alloy solder is: cubic boron nitride 30Wt%, alloy solder 70Wt%, plus 1Wt% Adhesive: The bonding strength between the cubic boron nitride composite layer and the matrix obtained in the same manner as in Example 1 is 147Mpa.

Embodiment 3

[0023] The composition of alloy solder is: Ti 5Wt%, Sn 6Wt%, Cu 89Wt%; the mixing ratio of cubic boron nitride and alloy solder is: cubic boron nitride 50Wt%, alloy solder 50Wt%, plus 5Wt% Adhesive: The bonding strength between the cubic boron nitride composite layer and the matrix obtained in the same way as in Example 1 is 131Mpa.

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Abstract

This invention relates to a kind of preparation method of cubic boron nitride compound material. Mixing the cubic boron nitride grain and alloy braze powder and binder and coating it on the surface of steel substrate, then heating by vacuum brazing can form the cubic boron nitride layer on the surface of steel substrate. The alloy brazes powder composed by the following elements (Wt. %): Ti 5-15, Sn 6-12, remains Cu. The cubic boron nitride compound layer has the high combination intensity can bear higher temperature and has higher total mechanical character.

Description

technical field [0001] The invention relates to a method for preparing superhard and wear-resistant composite materials by using cubic boron nitride. Background technique [0002] The molecular structure, physical properties and synthesis method of cubic boron nitride (c-BN) are very similar to diamond, its hardness is second only to diamond, and its thermal stability and chemical stability are better than diamond, and it can be heated in the atmosphere to Oxidation does not occur at 1000°C, especially there is no limitation of the reaction of black iron-based alloys processed by diamond products. It has become a new generation of superhard materials and is used as a substitute for diamond by the international material industry. In recent years, with the reduction of the production cost of cubic boron nitride and the improvement of its performance, the amount of cubic boron nitride and its products compared with the amount of diamond has increased from 1 / 20-1 / 30 to 1 / 6, and ...

Claims

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Application Information

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IPC IPC(8): C23C24/08C23C30/00B22F7/06
Inventor 任露泉卢广林邱小明王毅李世权汪春花刘杰王宏占王志杰张桂兰
Owner JILIN UNIV
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