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Chemical gold plating liquid

A technology of chemical gold plating and gold plating, applied in the direction of liquid chemical plating, metal material coating process, coating, etc., can solve the problems of poor welding adhesion and film adhesion, low toxicity, etc., and achieve welding adhesion Good, low toxicity, effect of improving bond strength

Active Publication Date: 2006-10-04
JX NIPPON MINING & METALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The electroless gold plating solution described in these patents is non-cyanide, so it has low toxicity and can be used near neutrality, but there are problems of poor solder adhesion and film adhesion

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～2

[0034] Plating solutions of the respective compositions shown in Table 1 were prepared as displacement type electroless gold plating solutions. As a material to be plated, a copper-plated printed wiring board having a resist opening of 0.4 mmφ was used, and plating was performed in the following steps.

[0035] Acid degreasing (45°C, 5 minutes)

[0036] →Soft etching (25°C, 2 minutes)

[0037] → Pickling (25°C, 1 minute)

[0038] →Activator (manufactured by Nippon Mining Metal Plastics Co., Ltd., KG-522)

[0039] (25°C, pH<1.0, 5 minutes)

[0040] → Pickling (25°C, 1 minute)

[0041] →Electroless Nickel-Phosphorus

[0042] (Plating solution: KG-530, manufactured by Nippon Mining Metal Plating Co., Ltd.

[0043] The phosphorus content in the coating is about 7%)

[0044] (88°C, pH4.5, 30 minutes)

[0045] →Displacement type electroless gold plating (plating solution and plating conditions described in Table 1)

[0046] →Reduction chemical gold plating

[0047] (Platin...

Embodiment 3～4、 comparative example 1～2

[0057] Plating solutions of the respective compositions shown in Table 1 were prepared as displacement type electroless gold plating solutions, and were plated in the same manner as in Example 1 to produce plated objects.

[0058] In the mensuration of solder bonding strength, use the Sn-3.0Ag-0.5Cu lead-free solder ball of 0.4mmφ, use the reflow furnace to carry out heating and bonding at a heating temperature of 250°C, except that, the same as that of Example 1 Evaluate in the same way. The evaluation results are shown in Table 1.

Embodiment 1

[0060] The condition of the electroless nickel-phosphorus plating among the embodiment 1 is, plating liquid: the phosphorus content in KG-571, KG-571, coating film is made by Nippon Metallurgy, and plating condition is 80 ℃, pH4.6, For 30 minutes, the displacement type electroless gold plating was performed under the conditions described in Table 1, and plating was performed in the same manner as in Example 1 to manufacture a plated product.

[0061] In the mensuration of solder bonding strength, use the Sn-3.0Ag-0.5Cu lead-free solder ball of 0.4mmφ, use the reflow furnace to carry out heating and bonding at a heating temperature of 250°C, except that, the same as that of Example 1 Evaluate in the same way. The evaluation results are shown in Table 1.

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PUM

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Abstract

A cyanide-free transposing type chemical gold plating solution that is less toxic, that can be used at near neutrality, and that gives an excellent and improved solder adhesion and plated film adhesion is provided. A chemical gold plating solution, comprising a cyanide-free water-soluble gold compound, a pyrosulfurous acid compound and a thiosulfuric acid compound. This plating solution preferably further contains a sulfurous acid compound and an aminocarboxylic acid compound. Pyrosulfurous acid and alkali metal salts, alkaline-earth metal salts, ammonium salts and other salts thereof can be used as the pyrosulfurous acid compound.

Description

technical field [0001] The invention relates to a coating technology, in particular to a non-cyanide displacement chemical gold plating solution. Background technique [0002] The displacement type electroless gold plating solution is used as an intermediate layer for the purpose of improving the solder adhesion of printed circuit boards, terminals, etc., and improving the adhesion of reduction type gold plating, etc. Many gold plating solutions used for this purpose use toxic cyanide compounds as gold compounds, but non-cyanide gold plating solutions that do not use toxic substances are required in consideration of the environment and workability. [0003] As the non-cyanide displacement type electroless gold plating solution, the gold plating solution (for example, refer to patent document 1, patent document 2) that uses gold sulfite compound, the gold plating solution that uses gold sulfite or chloroaurate (for example, refer to Patent Document 3), a gold plating solutio...

Claims

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Application Information

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IPC IPC(8): C23C18/42
Inventor 相场玲宏河村一三
Owner JX NIPPON MINING & METALS CO LTD
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