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Thermosetting epoxy resin composition and transparent material

A technology of resin composition and epoxy composition, applied in the field of thermosetting resin composition, capable of solving problems such as insufficient heat resistance and dimensional stability

Inactive Publication Date: 2006-10-04
DAICEL CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the heat resistance and dimensional stability of the resulting products are still insufficient

Method used

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  • Thermosetting epoxy resin composition and transparent material
  • Thermosetting epoxy resin composition and transparent material
  • Thermosetting epoxy resin composition and transparent material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-11 and comparative example 1-3

[0110] A series of thermosetting resin compositions were prepared by putting the components shown in Tables 2 and 3 into a 500 ml flask equipped with a stirrer and a thermometer, followed by stirring at 30°C for 20 minutes. The obtained thermosetting resin composition was poured into a Teflon (registered trademark) molding form having a depth of 1 mm on a glass plate coated with a release film, and another coated Glass plate with release film. The resin composition was cured under the following conditions to form a test sample.

[0111] In Examples 1, 3, 4, 6, 7, 8, and 9 and Comparative Examples 1 and 2, the resin composition was cured by heating at 50° C. for 4 hours and further heating at 180° C. for 2 hours.

[0112] In Examples 2, 5, 10, and 11 and Comparative Example 3, the resin composition was cured by heating at 70° C. for 3 hours and further heating at 180° C. for 2 hours.

[0113] The glass transition point, thermal decomposition temperature, dimensional stability...

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Abstract

A thermosetting epoxy resin composition is disclosed which is obtained by blending 0.01-20 parts by weight of a cationic polymerization initiator (C) and, if necessary, not more than 50 parts by weight of an acrylic resin having an epoxy group (D) to 100 parts by weight of a composition (E) which is composed of 10-99 weight% of a non-ester alicyclic epoxy compound (A) and 90-1 weight% of another epoxy compound (B) which is different from the compound (A). A cured product of such a thermosetting epoxy resin composition is excellent in heat resistance, dimensional stability and transparency, and therefore serves as an alternative to a glass substrate.

Description

technical field [0001] The present invention relates to a thermosetting resin composition resulting in a cured article having excellent optical clarity, dimensional stability and heat resistance and to an optically transparent material using the composition. Background technique [0002] Display devices using liquid crystals or organic electroluminescence (organic EL) have been introduced in mobile devices, thereby reducing the size, thickness, and weight of the mobile devices. Glass is generally used as a substrate and a display component of a display device using liquid crystal or organic EL. But any alternative to glass is needed because glass has a high specific gravity and is susceptible to impact. [0003] However, thermoplastic resins as substitutes are insufficient in heat resistance and optical transparency. Cured articles made from currently commercially available aromatic epoxy resins also have insufficient optical clarity. Furthermore, the heat resistance, opt...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/24C08G59/20
CPCC08G59/24C08G59/00
Inventor 高井英行前嵨尚
Owner DAICEL CHEM IND LTD
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