Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Manufacturing method of multifunction integrated sensor chip

A technology for integrating sensors and manufacturing methods, which is applied in the manufacture of semiconductor/solid-state devices, the manufacture of microstructure devices, and processes for producing decorative surface effects, etc. Small size, easy to package and easy to use

Inactive Publication Date: 2006-01-25
XI AN JIAOTONG UNIV
View PDF0 Cites 23 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, there are the following difficulties in integrating multiple sensors on one chip: first, the processing technology of various types of sensors may not be compatible; second, if a certain sensor on the same die needs to be in direct contact with the external environment , while other sensors must be sealed, which will cause difficulties in integrated packaging

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacturing method of multifunction integrated sensor chip
  • Manufacturing method of multifunction integrated sensor chip
  • Manufacturing method of multifunction integrated sensor chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] Refer to figure 1 , The present invention uses MEMS technology and integrated circuit micro-processing technology to make three sensitive units on a (100) crystal plane and 5mm×5mm die: pressure I, temperature II and humidity unit III. The backside of pressure unit I is C-type silicon The cup, temperature II and humidity unit III are arranged in the fixed branch area of ​​the die to eliminate the influence of pressure on the temperature and humidity unit. The chip is packaged on the borosilicate glass 1 through a vacuum bonding process. The key technology is the manufacturing process. Compatibility in the process. The three units are based on different effects. Among them, the pressure unit is based on the piezoresistive effect and is mainly used to detect the pressure change of the environment; the temperature unit is based on the thermal resistance effect and is used to detect changes in the ambient temperature; the humidity unit is based on the capacitance principle and...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Login to View More

Abstract

This invention discloses a preparing method for a multifunction integrated sensor chip, which applies micro-mechanical electronic technology and IC micro-processing technology to process three sensing units sensing pressure, temperature and humidity on an area of 5mmx5mm tube core, the pressure unit based on the piezo-resistance effect is used to test the pressure variance of environment, the temperature unit is used to test the change of environment temperature based on the thermal resistance effect and the humidity unit based on the capacitance theory used to test the variance of the environment humidity.

Description

Technical field [0001] The invention belongs to the field of micro-mechanical electronic system (MEMS) technology and integrated circuit micro-processing technology, and specifically relates to a method for manufacturing a multi-functional integrated sensor chip using micro-mechanical electronic system (MEMS) technology and integrated circuit micro-processing technology. Background technique [0002] At present, various single-function sensor manufacturing technologies based on MEMS technology have become more and more mature, and sensor technology is developing in the direction of integration and intelligence. There are three ways to integrate sensors: one is to integrate multiple sensors with the same or similar functions into a one-dimensional or two-dimensional sensor array; the second is to integrate the sensor and integrated circuit on the same chip; the third is to integrate the sensor and the integrated circuit on the same chip; One refers to the i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/00B81C1/00
Inventor 蒋庄德赵玉龙赵立波周建发
Owner XI AN JIAOTONG UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com