Apparatus for rotating point cutting large size silicon-carbide crystal

Abstract

An apparatus for cutting large-size SiC crystal by the moving dots is composed of base, sensor, sawing diamond string, pneumatic tension roller, working rollers, DC servo motor and 2D fixture mechanism consisting of rotary manipulator and step motor. A horizontal angle regulating turn-table is linked on a Y-axis moving platform. A vertical angle regulating turn-table is linked on said horizontal angle regulating one. Said step motor is fixed to an adjustable supporting plate.

Description

technical field [0001] The invention relates to a material processing equipment, in particular to a rotating point cutting large-size silicon carbide crystal device. Background technique [0002] SiC (silicon carbide crystal) is a superhard material with a Mohs hardness of 9.4, and only diamond materials with a Mohs hardness of 10 can be used to cut SiC. The existing traditional diamond saw blade can cut SiC due to the limitation of the diameter of the saw blade, and can only cut the bar with a diameter of less than 25mm, and the cutting kerf is wide due to the thickness of the saw blade, wasting expensive SiC materials. In the past five years, the diamond saw wire cutting equipment has been developed, and the cutting of SiC has been realized. For this reason, I have filed a number of patent applications, such as "desktop large-size precision diamond wire cutting machine (patent application number: 200410050285.6)", "gravity type Outer circle diamond outer circle cutting ma...

AI Technical Summary

Problems solved by technology

[0003] 1. Because the cutting method is surface contact cutting, the SiC surface shape and flatness after cutting are ≥0.70mm, and the parallelism is ≥1.0mm

Unable to adapt to the technical index requirements of cutting (generally, the technical index is that when the diameter of the bar is 50mm and the thickness of the slice is 1mm, the flatness is ≤0.10mm and the parallelism is ≤0.7mm)

[0004] 2. The horizontal cutting method is used, which limits the cutting space and can only cut materials with a diameter of 4 inches

[0005] 3. The saw rope reel is located above the frame body of the equipment, and it is inconvenient to change the saw rope.

[0006] 4. The basic structure of each part is easily deformed

The fixture cannot clamp the object to be cut, let alone adjust the cutting angle and slice degree, and is not suitable for cutting single crystal materials

[0008] 6. Since the reciprocating distance of the saw wire winding drum has been determined, the number of reciprocations during cutting is too many, which wastes the diamond saw wire and leaves many traces on the surface to be cut.

The system is controlled by a microcomputer, and the minimum speed of Z-axis feed is fast, which is not suitable for cutting superhard materials

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