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Method of treating bamboo floor using plasma

A technology of plasma and bamboo flooring, which is applied in wood treatment, wood treatment details, jointing of wooden veneers, etc. It can solve the problems of poor bonding performance and surface finishing performance of bamboo sheets

Inactive Publication Date: 2006-01-11
NANJING FORESTRY UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to reduce the wetting angle of bamboo green and bamboo yellow on the surface of bamboo slices by carrying out plasma treatment to the bamboo slices, so as to improve the surface wettability of bamboo slices, thereby effectively overcoming the existing problems of bamboo slices in the prior art. Problems such as poor bonding performance and surface finish performance

Method used

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Experimental program
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Effect test

Embodiment 1

[0015] Bamboo slices are dried at a temperature of 60° C., and the moisture content of bamboo slices is 3%.

[0016] The dried bamboo chips are processed by plasma, and the operating parameters of the plasma are: output power 20W; reflection power 0W; vacuum degree 2Pa; working gas O 2 ; The treatment time is 10min, so that the wetting angle of the bamboo surface is 24°.

[0017] The bamboo slices after plasma treatment enter the process step of gluing and forming blanks. The three-layer structure is a bamboo blank board composed of three layers of longitudinal bamboo slices. The bamboo slices are coated with urea-formaldehyde resin adhesive (model NQTRH), and the glue coating amount is 300g / m 2 .

[0018] The bamboo slabs after the glue-coating process are hot-pressed by a hot press, hot-pressing temperature: 110°C, hot-pressing time: 1.1min / mm, pressure: 2MPa / cm 2 .

[0019] The bonding strength of the bamboo floor after hot pressing can be increased by 30%.

Embodiment 2

[0021] Bamboo chip is dried under the condition of temperature 80 ℃, makes the moisture content of bamboo chip 3.5%.

[0022] The dried bamboo chips are processed by plasma, and the working parameters of the plasma are: output power 20W; reflection power 1W; vacuum degree 3Pa; working gas O 2 ; The treatment time is 10 minutes, so that the wetting angle of the bamboo surface is 23°.

[0023] The bamboo chips after plasma treatment enter the process step of gluing and assembling blanks. The structure is a bamboo blank board composed of a single layer of vertical bamboo chips. The bamboo chips are coated with urea-formaldehyde resin adhesive (model NQTRH), and the glue coating amount is 350g / m 2 .

[0024] The bamboo slab after the glue coating process is hot-pressed by a hot press, hot-pressing temperature: 125°C, hot-pressing time: 1.1min / mm, pressure: 3MPa / cm 2 .

[0025] The bonding strength of the bamboo floor after hot pressing can be increased by 30%.

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Abstract

A method for treating bamboo floor boards by plasma includes such steps as drying bamboo strips, plasma treating to make its surface wet angle less than 25 deg, coating resin, laminating and hot pressing.

Description

technical field [0001] The invention relates to a method for treating bamboo floor with plasma, and the bamboo floor after plasma treatment is a floor with high bonding strength. It belongs to the technical field of floor materials. Background technique [0002] Bamboo flooring is a flooring material made of bamboo. Because bamboo is beautiful, cool and durable, it is favored by consumers. However, due to the large surface wetting angles of bamboo green and bamboo yellow, the wettability is poor, and it is difficult to glue and finish, resulting in poor finishing performance and poor gluing performance of the floor surface. If bamboo green and bamboo yellow are completely removed in the floor strip processing process, then due to the characteristics of the hollow and thin walls of bamboo, a large amount of waste of bamboo chips will be caused for removing bamboo green and bamboo yellow when processed into floor strips. Therefore, bamboo flooring has problems such as high p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B27K5/00B27D1/04B32B21/14
Inventor 黄河浪卢晓宁彭红薛丽丹
Owner NANJING FORESTRY UNIV
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