Epoxy composition for light semiconductor packing

A technology of optical semiconductor and epoxy resin, which is applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve the problems of poor heat resistance, reliability of optical semiconductor components, high moisture absorption rate, etc., and achieve high durability Ultraviolet light, excellent light transmittance, low moisture absorption effect

Active Publication Date: 2005-05-11
CHANG CHUN PLASTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the alicyclic epoxy resin mentioned in the Japanese patent publication No. 03-94454 is adopted. Although the alicyclic epoxy resin can overcome the yellowing problem, its hardened product is brittle, easy to crack, and has high hygroscopicity. Under high humidity and other tests, it will cause reliability problems of optical semiconductor components
[0005] For this reason, the epoxy resin resistant to ultraviolet light also has hydrogenated bisphenol type epoxy resin to be developed, as the patent communiqué of Japanese Patent Application Laid-Open No. 6-136092, but the resin disclosed in the communiqué contains many chlorine-containing impurities, and the hydrogenation purity is only 50%. , the composition made of hydrogenated bisphenol-type epoxy resin has poor heat resistance, will change color under long-term heating, and has high moisture absorption rate, and its electrical properties will decrease under humidification test

Method used

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  • Epoxy composition for light semiconductor packing
  • Epoxy composition for light semiconductor packing
  • Epoxy composition for light semiconductor packing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0072] Each component used in embodiment and comparative example is described in detail as follows:

[0073] Epoxy resin a: Produced by Changchun Artificial Resin Factory, the bisphenol A polyglycidyl ether sold under the trade name BE-501 has an epoxy equivalent weight (EEW) of about 500g / eq.

[0074] epoxy resin b : The polyglycidyl ether of the cresol-aldehyde condensate produced by Changchun Artificial Resin Factory and sold under the trade name CNE 200ELA, its epoxy equivalent is between about 200 to 220g / eq, and the hydrolyzable chlorine is below 200ppm.

[0075] epoxy resin c : The triglycidyl ether of isocyanurate sold under the trade name TEPIC produced by Nissan Chemical Co., Ltd., has an epoxy equivalent of about 100 g / eq.

[0076] hardener : Hexahydrophthalic anhydride sold under the trade name HHPA produced by Nippon Chemical Institute, has an acid content of about 154 g / eq.

[0077] hardening accelerator : 2-methylimidazole.

[0078] Antioxidants : 2...

Synthetic example 1-

[0079] Synthesis example 1- Epoxy resin d (the epoxy resin of formula (1) of the present invention)

[0080] In a stainless steel autoclave with electromagnetic stirring, put 40 grams of epoxy resin b (CNE-200ELA, EEW=200, manufactured by Changchun Artificial Resin Factory Co., Ltd.), 120 grams of THF, and a commercially available 5wt% Ru-C catalyst 0.6 g, the reaction kettle was sealed, and hydrogen gas was introduced to make the pressure 5.0 MPa, the reaction temperature was controlled at 60°C, and the reaction time was 8 hours. After the reaction is finished, the catalyst is filtered, and the solvent is evaporated in a vacuum at 150° C. to obtain the aromatic ring hydrogenated epoxy resin (epoxy resin d) of the structure of formula (1), the hydrogenation rate of benzene nucleus is 84.8%, EEW=263 , Epoxy group loss rate = 24%.

Embodiment 1-6 and comparative example 1-3

[0082] According to the ingredients and amounts (% by weight) shown in Table 1 below, each ingredient was fully mixed with a stirrer, and then fully kneaded by a twin-shaft roller under the condition of 85°C. After cooling, it is pulverized to obtain an epoxy resin composition for semiconductor encapsulation.

[0083] Example 1

Example 2

Example 3

Example 4

Example 5

Example 6

Comparative example 1

Comparative example 2

Comparative example 3

Epoxy resin a

15

15

46

75

30

20

epoxy resin b

15

epoxy resin c

15

15

15

epoxy resin d

55

40

40

40

25

20

10

55

hardener

44.5

44.5

44.5

44.5

44.5

33.5

24.5

44.5

24.5

hardening accelerator

0.1

0.1

0.1

0.1

0.1

0.1

0.1

0.1

0.1

Antioxidants

0.4

0.4

0.4

0.4

0....

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Abstract

The invention relates to an epikote that can encapsulate the element of the optical semiconductor. The epikote includes (A) epikote (B)hardener(C)hard accelerator. The invention has the high transmissivity and low hygroscopic degree. It could resist the UV radiation and its colour is not changed under the long heating. It is specially used for the elements of blue and white optical semiconductor.

Description

technical field [0001] The invention relates to an epoxy resin composition for optical semiconductor packaging, which has excellent high light transmittance, excellent high resistance to ultraviolet light, long-term heating without discoloration, and low moisture absorption, and is suitable for optical semiconductor components. packaged application. Background technique [0002] Epoxy resin has been widely used in electronic applications such as electrical insulation, electronic semiconductor packaging, and laminates due to its easy processability, high safety, and excellent mechanical and chemical properties. Among them, the characteristics of colorless, transparent and excellent electrical characteristics make many optical semiconductor components such as light-receiving elements and light-emitting elements for optical applications, such as light-emitting diodes, optocouplers, receivers, etc., use epoxy resin as a plastic package. Material. [0003] Generally, epoxy resi...

Claims

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Application Information

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IPC IPC(8): C08L63/00C09K3/10H01L23/28
Inventor 黄坤源杜安邦陈智富
Owner CHANG CHUN PLASTICS
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