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Minisize heat flow accelerometer and method for making same

A technology of accelerometer and manufacturing method, which is applied in the field of sensors, can solve problems such as environmental temperature sensitivity, and achieve the effects of convenient mass production, light weight, and simple and mature production process

Inactive Publication Date: 2004-08-25
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The piezoresistive accelerometer is composed of a mechanical material that can stretch under acceleration. It places a piezoresistor at the position where the stretch occurs to obtain an electrical signal due to acceleration. This accelerometer can be used in a suitable Measures constant high acceleration at low cost, however it can only be used over a limited temperature range and is quite sensitive to ambient temperature

Method used

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  • Minisize heat flow accelerometer and method for making same
  • Minisize heat flow accelerometer and method for making same
  • Minisize heat flow accelerometer and method for making same

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Embodiment Construction

[0028] refer to Figure 1 to Figure 6 , the implementation method of the present invention comprises steps (such as Figure 4 ):

[0029] (1) On the monocrystalline silicon wafer 2, a low-pressure chemical vapor deposition process or a plasma-enhanced chemical vapor deposition process of general chemical vapor deposition equipment is used to deposit a layer of silicon nitride film or silicon dioxide film 8, (such as Pic 4-1 ). Embodiment A silicon nitride film is deposited by a low-pressure chemical vapor deposition process.

[0030] (2) Apply a layer of positive glue AZ1500 type photoresist 13 on the silicon nitride film or silicon dioxide film 8 with a glue applicator, and use the photolithography process of a general photolithography machine to photolithographically form the heating wire 6 and the temperature sensor 7 The resistance structure graph, (such as Figure 4-2 ).

[0031] (3) Sputter the first layer of chromium or titanium adhesion layer, the second layer of...

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PUM

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Abstract

The invention discloses a micro heat flow accelerometer, namely a micro sensor, and making method, composed of sealed monocrystal silicon wafer, heater wire, temperature sensor, inner and outer cavities, detecting circuit and so on. It uses gas as sensitive medium and using the theory that gas's natural convection changes under the action of acceleration to measure the acceleration in the direction of one or two coordinate axes. The heater wire and temperature sensor are suspended and fixed on the silicon cavity. The heat field produced by the heater wire changes when accelerated, the detecting circuit detects the temperature change of the temperature sensor so as to measure the acceleration value. It has no detecting mass block, elastic or strain beam, etc, so having reliable performance, simple and ripe technique, low making cost and so on, and it is specially applied to intelligent cannonball, car, toy, etc.

Description

technical field [0001] The invention relates to a miniature heat flow accelerometer and a manufacturing method thereof in the field of sensors, and is especially suitable as an acceleration sensor in intelligent shells, automobiles, toys and other occasions. Background technique [0002] Because accelerometers can measure physical quantities such as acceleration, velocity, displacement, and inclination, they are widely used in many fields such as inertial guidance, microsatellites, automatic control, navigation, GPS, car safety systems, and virtual game consoles. Several mechanical and electronic devices are capable of measuring acceleration, such as piezoelectric, piezoresistive, capacitive, tunneling, however there is still a desire to provide accelerometers that are less costly and more reliable than current devices. [0003] Micro-electromechanical system (MEMS) refers to a micro-system integrating micro-mechanical and micro-electronic components manufactured by batch pr...

Claims

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Application Information

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IPC IPC(8): G01K7/22G01P15/00
Inventor 杨拥军徐爱东徐永青
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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