Method of cutting workpiece of film filter

A cutting method and filter technology, applied in the direction of filters, electrical components, optical components, etc., can solve the problems of increasing the peak insertion loss of the finished product, increasing the internal stress of the film, and spectral deformation, and reducing the risk of peeling. , the effect of increasing the effective thickness and reducing the residual stress

Inactive Publication Date: 2003-11-12
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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Problems solved by technology

[0006] The above-mentioned existing method is suitable for ordinary thin-film filters with fewer film layers. However, the number of film layers of DWDM thin-film filters may exceed 150 layers. When the blade 301 of the cutting device 300 cuts the workpiece, the film stack will be caused The additional pressure inside increases the internal stress of the film layer. The pressure caused by the blade 301 will superimpose with the residual stress of the film stack, thereby increasing the peak insertion loss of the finished product and even distorting its spectrum. Moreover, the pressure may be reduced during cutting. destroy the stack

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  • Method of cutting workpiece of film filter
  • Method of cutting workpiece of film filter
  • Method of cutting workpiece of film filter

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no. 1 example

[0019] see figure 1 and figure 2 , the first embodiment of the present invention includes the following seven steps:

[0020] (1) providing an auxiliary substrate 14;

[0021] (2) coating transition layer 13 on substrate 14;

[0022] (3) fixing the workpiece 16 on the transition layer 13, the workpiece 16 comprising the film stack 11 positioned at the glass substrate 12;

[0023] (4) Remove air bubbles from the transition layer 13, and keep the membrane stack 11, the glass substrate 12, the transition layer 13 and the auxiliary substrate 14 parallel;

[0024] (5) curing the transition layer 13 connecting the auxiliary substrate 14 and the workpiece 16;

[0025] (6) cutting the combination of film stack 11, glass substrate 12, transition layer 13 and auxiliary substrate 14 into pieces 35;

[0026] (7) The transition layer portion 33 and the auxiliary base portion 34 are removed from the slice 35 .

[0027] In the first step, a heat source (not shown) is used to heat the...

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Abstract

The method includes two implementing modes. In the first mode, before cutting the work piece, the transition layer connects the assistant substrate to the glass substrate. In the second mode, an other work piece comprises one glass substrate with the thickness being thicker than the final expected thickness. Then, the unwanted part of the glass substrate is removed. The method of the two implementing modes increases the effective thickness of the work piece so as to reduce residual stress of the film filter plate finished product. Moreover, the risk of the film stack peeled off from the glass substrate is reduced when the work piece is cut.

Description

【Technical field】 [0001] The invention relates to a cutting method of a film filter workpiece, in particular to a cutting method of a dense wavelength division multiplexing (Dense Wavelength Division Multiplexing, DWDM) thin film filter workpiece. 【Background technique】 [0002] Optics and semiconductor technology have a great impact on social development, especially in the fields of electronic information and optical communication, and thin film technology is one of the application branches. These films can be single or multilayer coatings on substrates, or stand alone. [0003] Peak insertion loss is an important parameter for evaluating thin film filters. At present, a variety of precise control technologies have been developed, making it possible to deposit multi-layer thin films on the substrate, so that dense wavelength division multiplexing thin-film filters can meet the needs of increasing the number of cavities and reducing the channel spacing. These techniques in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/02H01L21/00H01L21/78
CPCG02B5/285H01L21/67092B28D5/022H01L21/78
Inventor 吕昌岳庄浩伟冯荣达陈杰良姚一鼎郁道琄韩兴华
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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