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Conductive adhesion agent, assembling structure and method for making said assembling structure

A technology for conductive adhesives and assembling structures, applied in conductive adhesives, conductive adhesive connections, printed circuit manufacturing, etc., can solve the problem of increased connection resistance, increased volume specific resistance of conductive adhesives, and easy vulcanization of silver. and other problems to achieve the effect of avoiding connection resistance and avoiding increase

Inactive Publication Date: 2002-07-17
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0025] As described above, the conductive filler is mainly made of silver, but silver is prone to vulcanization reaction, so when the silver is vulcanized, the volume specific resistance of the conductive adhesive increases, accompanied by an increase in the connection resistance
Solutions to this problem have been rarely reported so far, with the result that assembly structures using conductive adhesives cannot be applied to products with electronic components that may be used in such environments as around hot springs and volcanoes, where relatively high concentrations of hydrogen sulfide or sulfur dioxide are present
This greatly limits the application areas for assembling structures using conductive adhesives

Method used

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  • Conductive adhesion agent, assembling structure and method for making said assembling structure
  • Conductive adhesion agent, assembling structure and method for making said assembling structure
  • Conductive adhesion agent, assembling structure and method for making said assembling structure

Examples

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Effect test

Embodiment approach

[0123] This embodiment provides the flip-chip assembly structure of the present invention for a semiconductor element. Such as figure 2 As shown, the assembled structure includes a printed circuit board 6 (which is an example of an electrical structure), and a semiconductor element 7 (which is another example of an electrical structure). The semiconductor element 7 includes an IC substrate 8 and bump electrodes 9 formed on the surface of the IC substrate 8 . The printed circuit board 6 has an I / O terminal electrode 10 on its surface. The I / O terminal electrode 10 has formed thereon the conductive adhesive layer 1A made of the conductive adhesive 1 described in the first embodiment. I / O terminal electrodes 10 and bump electrodes 9 are electrically connected through layer 1A. Furthermore, a sealing resin 11 is provided to fill the gap between the semiconductor element 7 and the printed circuit board 6, thereby constituting a flip-chip assembly structure.

[0124] ...

Embodiment 1

[0129] Through this practical example, the conductive adhesive 1 described in the first embodiment is characterized by the elution-preventing film forming agent 4, which is an anthranilic acid (melting point: 143°C ≈ activation temperature) as its The main component of the liquid reagent, anthranilic acid is a chelating agent. Anthranilic acid reacts with Ag microparticles to form silver anthranilate, which is a metal complex, on the surface of the microparticles. Note here that the activation temperature (reaction temperature) of anthranilic acid, the service temperature of the conductive adhesive, and the curing temperature of the conductive adhesive satisfy the following relationship:

[0130] The use temperature of the conductive adhesive (32°C) is less than the activation temperature of anthranilic acid (143°C); and

[0131] The activation temperature (143°C) of anthranilic acid is equal to or less than the curing temperature (150°C) of the binder resin.

[0132] Theref...

Embodiment 2

[0135] As a feature of this practical example, in the composition of the conductive adhesive described in practical example 1, the anti-elution film forming agent is 1-nitroso-2-naphthol (melting point: 110° C.) The anti-elution film forming agent 4,1-nitroso-2-naphthol as the main component is used as a chelating agent instead of anthranilic acid. Other conditions are exactly the same as those in Practical Example 1, ie, the constitutional conditions of the conductive adhesive material, the manufacturing method, the use temperature, the curing temperature, and the like.

[0136] The activation temperature (reaction temperature ≈ melting point) of 1-nitroso-2-naphthol is about 110°C, and when the binder resin 2 is cured, 1-nitroso-2-naphthol reacts with the conductive particles 3, A metal complex is formed, that is, the elution prevention membrane 4 has 1-nitroso-2-naphthol silver as its main component. Silver 1-nitroso-2-naphthol is an ionizing material in water and readily ...

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Abstract

A conductive adhesive agent of the invention contains an elution preventing film-forming agent 4, which becomes reactive after electric continuity through a conductive particle 3 appeared in the conductive adhesive agent when a binder resin 2 is being hardened, to thereby form an elution preventing film 5 on a surface of the conductive particle 3. By using this conductive adhesive agent, the packaging structure is made migration resistant and sulfurization resistant.

Description

technical field [0001] The present invention relates to a conductive adhesive for connecting electronic components and printed circuit boards in the field of packaging of electronic components, an assembly structure using the conductive adhesive, and a method for manufacturing the assembly structure. Background technique [0002] Recently, a high awareness of environmental harmony has begun to limit the use of lead-containing solder alloys in the packaging field of electronic equipment, thereby necessitating the establishment of techniques for connecting electronic components using lead-free materials. [0003] Known lead-free packaging technologies use lead-free solder and conductive adhesive technology. Recently, however, more and more attention has been drawn to conductive adhesives expected to have advantages such as flexibility of connecting parts and lower packaging temperature. [0004] Conductive adhesives generally have conductive particles dispersed in a resin-bas...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/02H01B1/22H01L21/60H01L23/498H01R4/04H05K3/32H05K13/04
CPCH01L2924/01002H01L24/83H01L2224/29439H01L2924/01016H01L2224/16H01L2924/01015H01L24/28H01L2224/29444H01L23/49883H01L2924/0132H01L2924/01078H05K13/0469H01L2224/29355H01L2924/01013H01L2224/2919H05K2201/10636H05K2201/10674H01L2224/29111C09J9/02H01L2224/838H05K2201/0769H05K2203/121H01B1/22H01L2924/0665H01L2224/29499H01L2224/29347H01L2924/0781H01L2224/2929H05K3/321H01L2224/32225H01L2924/0105H01R4/04H01L2924/01327H01L2924/01047H01L2224/16225H01L2924/01046H01L2924/01006H01L2924/19041H01L2924/01079H01L2224/29339H01L2224/8319H01L2924/1579H01L2924/01082H01L2224/73204H01L2924/01011H01L2924/014H01L2924/01023H01L2924/01029H01L2924/19043H01L2924/01033H01L2924/01075H01L2224/05568H01L2224/05573H01L2924/00014Y10T428/2982Y10T428/2984Y02P70/50H01L2924/00H01L2924/00012H01L2924/3512H01L2224/05599
Inventor 竹泽弘辉石丸幸宏北江孝史三谷力西山东作
Owner PANASONIC CORP
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