Photoresist supply system and method

Abstract

A photoresist supply system includes a storage bottle and a reservoir, and the storage bottle is connected to the reservoir. A vacuum pump is connected to the reservoir to generate a vacuum state in the reservoir for sucking the photoresist out of the storage bottle and into the reservoir. An inlet into the reservoir causes photoresist to flow along an inner wall of the reservoir. The photoresist flows out of the reservoir into a dispensing reservoir, and the photoresist is pumped to a dispensing nozzle for application to a wafer or substrate.

Description

technical field [0001] The present invention relates to the manufacture of semiconductor wafers and optical disks, and more particularly to a supply system and method for photoresist or other similar operating fluids. Background technique [0002] In the fabrication process of semiconductor wafers, photoresists are used to form patterns on the surface of semiconductor wafers. The lithography process usually determines the surface size of circuit manufacturing and circuit structures, and is a key process for wafer manufacturing. As integrated circuits become smaller and the integration of transistors in integrated circuits increases, the precision of lithography and the ability to pattern smaller features becomes more important for advanced semiconductor fabrication processes. [0003] Generally speaking, the lithography process includes coating a photoresist layer on the surface layer of a semiconductor wafer, and then exposing the photoresist through a pattern to transfer ...

AI Technical Summary

Problems solved by technology

These pre-existing microbubbles can cause defects in the fabricated structure in many ways, including: distorting the pattern (this pattern is defined by avoiding sharp corners at the edge of the pattern, to be transferred or fabricated on a wafer or disk surface pattern), inability to provide the desired etch mask, improper photoresist removal caused by avoiding photoresist sticking to the wafer or disk surface during development, and other defects

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