Semiconductor laser device

Abstract

A semiconductor laser device comprising: a semiconductor laser element; a frame with an element arrangement portion in which the element is arranged; and a resin bonded to the frame, wherein the frame has a thicker portion and a thinner portion In the portion, the thicker portion is formed so as to extend at least in the width direction of the resin, covering an area having a length equal to or greater than this width. Thus, the thick-walled construction of the frame improves heat dissipation and strength. Also, it stabilizes the positioning of the datum plane and improves attachment accuracy.

Description

technical field [0001] The invention relates to a semiconductor laser device. Background technique [0002] Semiconductor laser devices employing a package comprising a lead frame and a resin mold attract great attention because they are relatively cheap and easy to mass-produce. However, such a resin molded housing has a disadvantage of poor heat dissipation compared with conventional widely used metal skin housings. For this reason, resin molded housings are now used almost exclusively in infrared lasers with good temperature characteristics, and not in high-output lasers for CD-R / W drives, or infrared lasers for DVD drives, or require high operating voltage of blue or similar lasers. For example, in Japanese Patent Application Laid-Open No. H11-307871, an improvement to a resin molded case for better heat dissipation is proposed. According to this proposal, the portion of the lead frame on which the laser element is mounted is thickened, and the lead frame is enclosed ...

AI Technical Summary

Problems solved by technology

However, with this configuration, when the main lead frame 103 is fed a predetermined distance on the machine before the tie bars are cut, vibrations of the feed or the like cause, for example, the end portion of the first lead frame 100 to move in the direction indicated as G1 or G2. tilt up

Images