Compsite wire with noble metal cladding

A technology of composite metal and packaging components, which is applied in the field of composite metal wire and composite metal wire manufacturing, can solve the problem of not satisfying, not giving metal wire, and not being able to connect the metal wire with 4N gold alloy and wrap it in the core of copper metal wire, etc. question

Inactive Publication Date: 2005-02-02
HERAEUS MATERIALS SINGAPORE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

4N gold alloys have a higher elastic modulus than pure copper, but copper-based bonding wire alloys do not meet this future demand for sufficient elastic modulus
In addition, none of these techniques can wrap the 4N gold al

Method used

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  • Compsite wire with noble metal cladding
  • Compsite wire with noble metal cladding
  • Compsite wire with noble metal cladding

Examples

Experimental program
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Embodiment Construction

[0024] figure 1 A composite metal wire of an embodiment of the invention is shown wherein a core 12 comprising a non-noble metal is joined to an annular portion 14 of a noble metal. (Noble metals are defined as metals that are heated in air without being oxidized and include platinum, palladium, silver, or similar metals in addition to gold.) R represents the radius of the wire 10 consisting of the core 12 and the annular portion 14, And r denotes the radius of the core 12 . The amount of core material 12 relative to annular portion 14 and wire 10 is expressed as a "section ratio" measured by cross-sectional area, which is a function of the ratio of r to R (r / R).

[0025] The connection is made by applying heat and pressure. The amount of heat and pressure applied will depend on the non-precious metal or metal alloy core material and the noble metal or metal alloy annular portion material used and can be readily determined by one of ordinary skill in the metallurgical arts w...

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PUM

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Abstract

Composite wires in which a noble metal annulus is welded to an electrically-conductive, non-noble metal wire core. Methods of forming the composite wire and semiconductor packaging having at least one lead bonded to the composite wire are also disclosed.

Description

technical field [0001] The present invention relates to an electrically conductive composite noble metal wire in which a non-noble metal core is surrounded by a noble metal annular portion. Specifically, the present invention relates to a composite metal wire obtained by co-extruding a non-noble metal core material and a noble metal. The invention also relates to a method of manufacturing a composite metal wire, the core of which comprises a non-noble metal and is clad with a noble metal annular portion by co-extrusion of the non-noble metal core material and the noble metal. Background technique [0002] The development of semiconductor packaging to small pitch, long span and low packaging cost is far from meeting the needs of modern gold connecting metal wire technology. The wire elastic modulus, cost and strength require the use of a more complex wire material than the commonly used 4N gold alloy. [0003] Future connecting wires need to meet the approximately 50 micron...

Claims

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Application Information

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IPC IPC(8): B21C23/26B21C37/04C22C5/02H01B1/02H01B5/02H01B13/00H01L21/60
CPCH01L2924/01032H01L2924/01046H01L2924/01082B21C37/042H01L2224/4321H01L2924/01004H01L2224/45572H01L2924/20752H01L2924/01029H01L2224/4312H01L2924/01027H01L2924/01028H01L2924/20756H01L2224/4847H01L2224/45639H01L24/48H01L2224/45147H01L2924/01202H01L2924/20751H01L2224/45015H01B1/02H01L2924/01204H01L24/43H01L2924/20753H01L2224/45644H01L2924/01047H01L2224/45669H01L2924/01079H01L2224/45565H01L2224/48247H01L24/45H01L2924/01033H01L2924/20757H01L2924/01005H01L2924/01006H01L2924/20754H01L2224/48455H01L2924/0102H01L2924/20755H01L2224/45664H01L2924/01078H01L2224/45144H01L2224/48799H01L2224/43H01L2224/43848H01L2224/45H01L2224/456H01L2924/00011H01L2924/013H01L2924/00H01L2924/00014H01L2924/20106H01L2924/20107H01L2924/20108H01L2924/20109H01L2924/2011H01L2924/20111H01L2924/00012H01L2924/01201H01L2924/01049H01L2924/00013C23C18/42
Inventor J·M·佐伊恩蒂恩斯
Owner HERAEUS MATERIALS SINGAPORE
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