Flexible micro-pressure sensor and preparation process
A micro-pressure sensor and preparation technology, applied in cardiac catheters, catheters, etc., can solve problems such as fistula blockage, thrombus formation, and slow blood flow, and achieve the effects of accurate monitoring, high electrical insulation, and small volume
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Embodiment 1
[0036] Example 1: as figure 1 As shown, a flexible micro-pressure sensor includes two flexible substrates with micro-deformability and insulation, which are a lower flexible substrate 1 and an upper flexible substrate 2 respectively. The two flexible substrates are stacked in sequence, and the upper surface of each flexible substrate is arranged The printed circuit and the lead pins connected to the printed circuit, wherein, the lower flexible substrate 1 is the first printed circuit 7, the lead is the first lead 5, the upper flexible substrate 2 is the second printed circuit 11, the lead is the second lead 9; the topmost printed circuit and the lead are provided with a flexible protective layer 12, each printed circuit includes a capacitor plate in the middle and an inductance coil surrounding the capacitor plate, and the lower flexible substrate 1 is The first capacitor plate 6 and the first inductance coil 4, and the second capacitor plate 10 and the second inductance coil ...
Embodiment 2
[0051] Example 2: as Image 6 As shown, other structures are the same as the embodiment, except that the flexible substrate has three layers, and the incision on the top flexible substrate 13 is set back relative to the incision on the upper flexible substrate 2, so that the third lead on the top flexible substrate 13 is connected to the upper layer. The second lead pins 9 on the flexible substrate 2 can be connected to form an LC circuit of a three-pole capacitor.
[0052] The preparation process of the present embodiment is as follows:
[0053] S1, prepare a three-layer flexible substrate for the micro pressure sensor, and cut a slope 3 with a certain slope on the upper flexible substrate 2 and the top flexible substrate 13, and the slope 3 on the top flexible substrate 13 is opposite to the upper flexible substrate 2. Bevel 3 set back;
[0054] S2, inkjet printing the first printed circuit 7 and the first lead 5 on the upper surface of the lower flexible substrate 1 to fo...
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