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Vacuum cavity processing method and circuit board

A vacuum cavity and processing method technology, applied in the direction of multilayer circuit manufacturing, etc., can solve problems such as lead-free soldering manufacturing cavity reliability, to ensure functional characteristics and soldering reliability, low insertion loss, and meet signal requirements. effect of demand

Pending Publication Date: 2022-07-19
SHENNAN CIRCUITS
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  • Claims
  • Application Information

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Problems solved by technology

[0004] This application mainly provides a processing method of a vacuum cavity and a circuit board to solve the reliability problem of the cavity produced by lead-free soldering in the prior art

Method used

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  • Vacuum cavity processing method and circuit board
  • Vacuum cavity processing method and circuit board
  • Vacuum cavity processing method and circuit board

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Embodiment Construction

[0019] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of this application.

[0020] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. As used in the examples of this application and the appended claims, the singular forms "a," "the," and "the" are intended to include the plural forms as well, unless the above clearly dictates otherwise, "a plurality of" "Generally includes at least two, but does not exclude ...

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Abstract

The invention discloses a processing method of a vacuum cavity and a circuit board. The processing method of the vacuum cavity comprises the following steps: providing a first substrate, a second substrate and a third substrate; manufacturing a first circuit pattern on the surface of the first substrate, and manufacturing a second circuit pattern on the surface of the third substrate at a position corresponding to the first circuit pattern; a through groove is formed in the position, corresponding to the first circuit pattern, of the surface of the second substrate, and the through groove penetrates through the second substrate; and the first substrate, the second substrate and the third substrate are sequentially connected to form the vacuum cavity. According to the vacuum cavity in the PCB manufactured through the method, the requirement for low insertion loss is met, the signal requirement in a specific scene is met, and lead-free welding can be achieved.

Description

technical field [0001] The invention relates to the technical field of circuit board fabrication, in particular to a processing method of a vacuum cavity and a circuit board. Background technique [0002] With the improvement of PCB board requirements for low insertion loss, traditional PCB boards can no longer meet the needs of specific scenarios. [0003] Air has gradually attracted attention because of its low dielectric constant DK and dielectric loss Df, which can meet the signal requirements in specific scenarios. application. SUMMARY OF THE INVENTION [0004] The present application mainly provides a method for processing a vacuum cavity and a circuit board, so as to solve the reliability problem of the cavity made by lead-free soldering in the prior art. [0005] In order to solve the above problems, the present application provides a processing method of a vacuum chamber, including: providing a first substrate, a second substrate and a third substrate; making a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
CPCH05K3/4611H05K3/4623H05K3/4697
Inventor 王建强
Owner SHENNAN CIRCUITS
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