LED packaging device

A technology of LED packaging and LED chips, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of increasing packaging costs, product scrapping, and easy breakage, and achieve the goal of reducing overall cost, reducing edge stress, and increasing light extraction rate Effect

Pending Publication Date: 2022-07-12
QUANZHOU SANAN SEMICON TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, during the process of heating and pressing, the lens under this structure will be subjected to internal thermal stress and external pressure, thus forming a large concentrated stress at the right-angle edge of the inner cavity of the lens base
The lens is made of quartz glass, which is easy to break. When the stress exceeds the maximum tension it can bear, it will break along the edge, resulting in the scrapping of the product and greatly increasing the packaging cost.

Method used

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Examples

Experimental program
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Effect test

no. 1 example

[0031] According to one aspect of the present application, an LED package device is provided. see figure 2 , figure 2 It is a cross-sectional view of the LED package device according to the first embodiment of the present application. The LED package device includes a package substrate 100 , an LED chip 200 and a light-transmitting unit 300 . The package substrate 100 has a first surface 1001 and a second surface 1002 disposed opposite to each other. The LED chip 200 is disposed on the first surface 1001 of the package substrate 100 . The light-transmitting unit 300 is disposed on the first surface 1001 of the package substrate 100 , and has an inner cavity 310 , and the LED chip 200 is located in the inner cavity 310 . The inner cavity 310 has an upper surface 311 and a side surface 312, the upper surface 311 and the side surface 312 have a first connecting portion 313, and the first connecting portion 313 is a curved surface or an inclined surface or a combination ther...

no. 2 example

[0040] image 3 It is a schematic cross-sectional view for explaining the LED package device of the second embodiment of the present application. The difference from the first embodiment is:

[0041] The light-transmitting unit 300 includes a base 320 and a light-transmitting area 330 . The base 320 has a lower surface 321 in contact with the first surface 1001 of the package substrate. The second connecting portion 322 is a curved surface, and the curved surface has a changing slope. In a specific embodiment, the second connecting portion 322 is a rounded corner, that is, an arc-shaped edge is formed between the lower surface 321 and the side surface 312 , and the convex direction of the arc-shaped edge is a direction close to the inner cavity 310 . A rounded structure is provided between the lower surface 321 and the side surface 312 of the base 320 to replace the right-angle structure in the prior art (such as figure 1 shown), it can play a great role in the stress trans...

no. 3 example

[0043] Figure 4 It is a schematic cross-sectional view for explaining the LED package device of the third embodiment of the present application. The difference from the above embodiment is that the side surface 312 of the inner cavity 310 of the light-transmitting unit 300 forms an acute angle with the normal of the first surface 1001 of the package substrate 100 , and the acute angle α is greater than or equal to 5°. Preferably, the acute angle α is between at 5°~60°. Setting the side surface 312 as an inclined surface structure can make the stress on the side surface 312 of the inner cavity 310 of the light-transmitting unit 300 evenly distributed, so as to make the transition smoothly. In addition, since the side surface and the normal Z of the first surface 1001 of the package substrate 100 form an acute angle, the inner cavity 310 has a "regular trapezoid" structure, which can increase the light extraction rate of the LED chip and increase the light extraction efficienc...

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Abstract

The invention provides an LED packaging device, and the device comprises a packaging substrate which is provided with a first surface and a second surface, and the first surface and the second surface are opposite to each other; the LED chip is arranged on the first surface of the packaging substrate; the light-transmitting unit is arranged on the first surface of the packaging substrate, the light-transmitting unit is provided with an inner cavity, and the LED chip is located in the inner cavity; wherein the inner cavity is provided with an upper surface and a side surface, the upper surface and the side surface are provided with a first connecting part, and the first connecting part is a curved surface or an inclined surface or a combination of the curved surface and the inclined surface. The structure can reduce the edge stress of the light-transmitting unit and reduce the risk that the light-transmitting unit is broken along the edge while the light-emitting efficiency of the LED chip is not influenced.

Description

technical field [0001] The present application relates to the technical field of semiconductors, and in particular, to an LED package device. Background technique [0002] According to different packaging materials, LED packaging devices can be divided into LED packaging devices with glass lens structure and LED packaging devices with resin structure. For deep ultraviolet LED chips, because the resin tends to reduce the transparency under the action of ultraviolet light and thus affects the light extraction efficiency of the LED packaging device, the LED packaging device is usually selected as an LED packaging device with a glass lens structure. [0003] like figure 1 As shown, when the LED package device is packaged, the existing cover lens methods are all performed in a high temperature and vacuum environment. However, in the process of heating and pressing, the lens under this structure will be subjected to internal thermal stress and external pressure, so that a large ...

Claims

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Application Information

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IPC IPC(8): H01L33/58H01L33/48
CPCH01L33/58H01L33/486H01L33/62
Inventor 晏天宇黄森鹏李达诚陈顺意余长治
Owner QUANZHOU SANAN SEMICON TECH CO LTD
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