Polyamide composition and application thereof

Abstract

The invention discloses a polyamide composition and application thereof, and belongs to the technical field of LAP. The polyamide composition comprises the following components in parts by weight: 50-90 parts of polyamide, 0.5-2 parts of a laser initiator, 1-5 parts of a laser protective agent and 5-30 parts of flaky filler, the laser initiator is a solid solution formed by a metal oxide solvent and a metal oxide solute; the laser protective agent is an isocyanate compound. The polyamide composition can effectively solve the problems of overflow plating, skip plating and the like in the LAP technology laser etching chemical plating process, and a high-quality three-dimensional circuit with a uniform surface circuit is obtained.

Description

technical field [0001] The invention belongs to the technical field of LAP, and in particular relates to a polyamide composition and use thereof. Background technique [0002] Laser Activating Plating (LAP) is a technology that uses laser to induce selective metal plating on ordinary plastic substrates. It can produce electrical appliances and interconnected devices with electrical functions on any molding surface. Mobile phones, wearable devices, LEDs and other fields have broad application prospects. However, the traditional Laser Direct Structuring (LDS) technology requires special LDS laser modified materials, which restricts the development space of its market application, resulting in its lack of cost advantages compared with traditional FPC and other technologies. difficult to promote on a large scale. The three-dimensional properties of LAP are consistent with LDS, but LAP does not require specific LDS laser-induced materials, and the material cost is saved by 50% ...

AI Technical Summary

Problems solved by technology

[0003] In the conventional LAP process, due to the soft and fragile material of the ordinary plastic substrate, the product is easily burnt during the laser engraving process, resulting in a rough outline of the line and making the line of the engraved layer unstable. The residual amount of acid-base potion on the rough outline of the line is relatively large, causing the line outline of the product to be corroded, resulting in spots and micropores, which affect the adhesion of the coating on the product, and eventually lead to undesirable phenomena such as overflow plating and missing plating on the product

The prior art CN 111805091 A and CN 112739024 A both propose process improvement methods for this problem of the LAP process, but there is no report that the polymer material used in the LAP process can improve the undesirable problems such as overflow plating and missing plating

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