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Evaporation-boiling longitudinal coexistence composite structure for enhancing boiling heat transfer

A composite structure and enhanced boiling technology, applied in indirect heat exchangers, lighting and heating equipment, semiconductor devices, etc., can solve problems such as occupation, achieve heat transfer area expansion, strengthen disturbance, improve heat transfer performance and critical heat flux density Effect

Pending Publication Date: 2022-05-27
ANHUI UNIVERSITY OF TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, there is still room for improvement in this application. Its porous structure and channels jointly occupy the heating surface, which sacrifices a part of the phase change heat transfer area while enhancing heat transfer.

Method used

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  • Evaporation-boiling longitudinal coexistence composite structure for enhancing boiling heat transfer
  • Evaporation-boiling longitudinal coexistence composite structure for enhancing boiling heat transfer
  • Evaporation-boiling longitudinal coexistence composite structure for enhancing boiling heat transfer

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Embodiment 1

[0030] An evaporation-boiling vertical coexistence composite structure for enhancing boiling heat transfer in this embodiment, such as figure 2 As shown, it includes a horizontally arranged heating substrate 1, the upper surface of the heating substrate 1 is fixedly installed with a porous capillary core 3 through a vertically arranged thermally conductive micro-column 2, and the lower surface of the porous capillary core 3 is provided with a protrusion 31. There is a superheated fluid working medium region 4 between 1 and the porous capillary core 3. The upper surface of the thermally conductive micropillars 2 and the lower surface of the porous capillary core 3 are connected by a sintering method to form a composite structure, and channels are formed between the composite structures.

[0031] In the composite structure of the present invention, the thermally conductive micropillars 2 are selected from materials with high thermal conductivity, such as copper, aluminum or gold...

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Abstract

The invention discloses an evaporation-boiling longitudinal coexistence composite structure for strengthening boiling heat transfer, and relates to the technical field of strengthening boiling heat transfer. The evaporation-boiling longitudinal coexistence composite structure for strengthening boiling heat transfer comprises a heating substrate and a plurality of heat conduction micro-columns arranged on the substrate, the upper ends of the heat conduction micro-columns are combined with a porous capillary core to form a composite structure, and small bubbles discharged by evaporation of the porous capillary core are utilized to increase a gasification core of a boiling area at the bottom of the porous capillary core. The boiling starting point is lowered, flow field disturbance is enhanced, boiling heat transfer of a bottom liquid area is enhanced, and in addition, the heat transfer area is increased in the longitudinal direction. Protrusions are arranged on the lower surface of the porous capillary core, so that small bubbles are easier to separate and enter a superheated fluid working medium area at the bottom, stable separation of the bubbles is accelerated, occurrence of an air film formed by direct boiling in an area between a heating surface and the lower surface of the porous capillary core is delayed, and porous evaporation-boiling synergistic reinforcement phase change heat transfer is achieved.

Description

technical field [0001] The invention relates to the technical field of enhancing boiling heat transfer, in particular to an evaporation-boiling vertical coexistence composite structure for enhancing boiling heat transfer. Background technique [0002] Due to the development characteristics of miniaturization and high integration of microelectronic devices, they also put forward higher requirements for efficient heat dissipation methods. At present, boiling heat transfer, as an efficient energy transfer method accompanied by gas-liquid phase transition, has the characteristics of small heat transfer temperature difference and large heat flux density, and has become an important technical means to solve this problem. [0003] At present, a large number of studies have shown that porous media have high specific surface area and strong capillary suction capacity. When directly applied to boiling heat transfer, the pore structure inside the porous can not only expand the heat tra...

Claims

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Application Information

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IPC IPC(8): F28D15/04H01L23/427
CPCF28D15/046H01L23/427
Inventor 汪冬冬何孝磊楚化强林琦方威震林家瑜杨磊
Owner ANHUI UNIVERSITY OF TECHNOLOGY
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