Organic field effect transistor memory based on polyvinyl alcohol and preparation method thereof
A technology of polyvinyl alcohol and polyvinyl alcohol solution, which is applied in the manufacture of semiconductor/solid-state devices, semiconductor devices, electric solid-state devices, etc., can solve problems such as affecting the device storage rate and device stability, hindering the charge transfer of organic field effect transistors, etc. Achieve the effect of easy promotion and integration of commercial applications, low price, and improved stability
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Embodiment 1
[0043] An organic field effect transistor memory based on polyvinyl alcohol, the structure diagram is as follows figure 1 As shown, the structure of the memory includes a source-drain electrode 1, an organic semiconductor layer 2, a charge storage layer 3, a gate insulating layer 4, and a gate electrode 5 as a substrate from top to bottom; wherein, the charge storage layer and A hydrophobic film layer 6 is also arranged between the gate insulating layers; the hydrophobic film layer 6 is prepared by spin-coating a hydrophobic film solution on the gate insulating layer 4, and the hydrophobic film solution is polytetrafluoroethylene dispersed in water. Formation; the charge storage layer 3 is prepared by spin-coating a polyvinyl alcohol solution on the hydrophobic film layer 6, and the polyvinyl alcohol solution is formed by dissolving polyvinyl alcohol in a dimethyl sulfoxide solvent.
[0044] The organic field effect transistor memory uses N-type heavily doped silicon as the ga...
Embodiment 2
[0062] A preparation method of an organic field effect transistor memory based on polyvinyl alcohol, the specific steps are as follows:
[0063] (1) Disperse the polytetrafluoroethylene suspension in water to a concentration of 10% after dilution, and treat it with ultrasound for 15 minutes before use.
[0064] (2) Dissolve polyvinyl alcohol Mw ~ 116000 material in dimethyl sulfoxide solvent at a concentration of 3 mg / mL, heat at 60°C to dissolve completely, and let stand for later use.
[0065] (3) Cut the silicon wafer of N-type heavily doped silicon and the 50nm silicon dioxide gate insulating layer grown on it into a size of 1.5cm×1.5cm, and pass through acetone for 15min, ethanol for 15min, and deionized water for 15min in sequence Wash and dry at 120°C.
[0066] (4) Place the clean substrate after drying treatment for 5-10 minutes with ultraviolet ozone.
[0067] (5) Filter the prepared polytetrafluoroethylene solution with a 0.22 μm filter, suck it with a syringe and ...
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