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Laser rapid prototyping method and device easy for solid separation

A laser rapid prototyping, solid technology

Pending Publication Date: 2022-05-17
JINAN SENFENG TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] At present, due to the common shortcomings of laser sintered parts such as low density, low strength, and poor dimensional accuracy, how to improve the powder spreading accuracy, powder spreading compaction density, reduce the surface roughness of the formed entity, and increase the density of the formed entity, As well as how to avoid sintering between the formed entity and the powder-coated substrate and how to easily separate the rapid prototyping entity are all problems that plague researchers.

Method used

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  • Laser rapid prototyping method and device easy for solid separation
  • Laser rapid prototyping method and device easy for solid separation

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Embodiment Construction

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0028] First of all, the present invention provides a laser rapid prototyping method that is easy to separate entities, which includes the following steps:

[0029] Step 1, laying the first layer of powder layer on the upper surface of the powder spreading substrate, and leveling and compacting the first layer of powder layer;

[0030] Step 2, irradiate and sinter the first powder layer on the powder-coating substrate through the laser scanning component, so t...

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Abstract

The invention provides a laser rapid prototyping method and device easy for solid separation, and belongs to the technical field of laser rapid prototyping. According to the laser rapid prototyping method easy for solid separation, an isolation layer is arranged between a powder laying substrate and a processed solid by changing the processing parameters and the scanning angle of a laser scanning assembly; the characteristics of low static strength and low shearing resistance of the isolating layer are utilized to easily separate the manufactured entity from the powder laying substrate, so that the appearance structure of the processed entity is prevented from being damaged in the separation process; according to the laser rapid prototyping device easy for solid separation, all-directional closed transfer of powder between the powder feeding cylinder and the prototyping cylinder can be realized, so that powder waste is avoided.

Description

technical field [0001] The invention belongs to the technical field of laser rapid prototyping, and in particular relates to a laser rapid prototyping method and device for easy entity separation. Background technique [0002] Laser Rapid Prototyping (LRP) is a new manufacturing technology that integrates advanced technologies such as CAD, CAM, CNC, laser, precision servo drive and new materials. Moreover, compared with traditional manufacturing methods, laser rapid prototyping technology has the advantages of high replicability and interchangeability of prototypes, manufacturing process has nothing to do with the geometry of the prototype, short processing cycle, and low cost. [0003] The principle of laser rapid prototyping technology is to use computer software to generate a three-dimensional solid model, and then layer the three-dimensional solid model through layering software, and drive and control the laser beam to scan the powder in the area to be formed through the...

Claims

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Application Information

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IPC IPC(8): B22F10/28B22F10/366B22F12/67B22F12/88B22F12/90B33Y10/00B33Y30/00B33Y40/00
CPCB22F10/28B22F10/366B22F12/67B22F12/88B22F12/90B33Y10/00B33Y30/00B33Y40/00Y02P10/25
Inventor 刘士鹏李峰西邢振宏崔炳军刘鹏
Owner JINAN SENFENG TECH CO LTD
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