Prepreg prepared from boron nitride modified by continuous method and high-thermal-conductivity thermosetting high-frequency copper-clad plate

A prepreg, boron nitride technology, applied in the field of communication materials, can solve problems such as poor thermal conductivity and heat dissipation, and achieve the effects of reducing environmental protection pressure, reducing production costs, and improving bending strength

Pending Publication Date: 2022-05-06
CHANGZHOU ZHONGYING SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] However, the thermal conductivity and heat dissipation performance of the prepreg in this invention patent is relatively poor, which is far from meeting the standard in today's smaller, lighter, and higher-speed, high-frequency, lossless communication application environments.

Method used

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  • Prepreg prepared from boron nitride modified by continuous method and high-thermal-conductivity thermosetting high-frequency copper-clad plate
  • Prepreg prepared from boron nitride modified by continuous method and high-thermal-conductivity thermosetting high-frequency copper-clad plate
  • Prepreg prepared from boron nitride modified by continuous method and high-thermal-conductivity thermosetting high-frequency copper-clad plate

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0055] Take 120 parts of boron nitride (BN, D50=10um) and mix it in 3500 parts of pure water. After ball milling and dispersing for 30 minutes, add 70 parts of NaOH to it. After 8 hours of ultrasound-assisted reaction at 80°C, add acetic acid to adjust the pH Values ​​between 6-7 give a homogeneous dispersion of activated boron nitride.

[0056] Configuration 2wt%H 2 100 parts of O / ethanol mixed solution, add 0.7 parts of coupling agent KH550 and 2.3 parts of coupling agent KH570, after stirring at 55°C for 5 minutes, adjust the pH value of the system to between 3-5, and continue stirring for 15 minutes to obtain Activated coupling reagent solution.

[0057] Pour the activated coupling agent solution into the uniform dispersion of activated boron nitride, continue to stir at 60°C for 4 hours, filter and wash the product with water several times until the pH value of the filtrate is between 7-8 ; Finally, after the filter cake was rinsed with ethanol and toluene in turn, the ...

Synthetic example 2

[0060] Take 120 parts of BN (D50=20um) and mix them in 3500 parts of pure water. After ball milling and dispersing for 30 minutes, add 80 parts of NaOH to it. After 12 hours of ultrasound-assisted reaction at 80°C, add acetic acid to adjust the pH value at 6- 7, a uniform dispersion of activated boron nitride was obtained.

[0061] Configuration 2wt%H 2 100 parts of O / ethanol mixed solution, add 0.8 parts of coupling agent KH550 and 3.5 parts of coupling agent KH570, stir at 50°C for 10 minutes, adjust the pH value of the system to between 3-5, and continue stirring for 20 minutes to obtain Activated coupling reagent solution.

[0062] Pour the activated coupling agent solution into the uniform dispersion of activated boron nitride, continue to stir at 60°C for 5 hours, filter and wash the product with water several times until the pH value of the filtrate is between 7-8; finally, put After the filter cake was rinsed with ethanol and toluene in sequence, the modified BN co-m...

Synthetic example 3

[0065] Take 120 parts of BN (D50=30um) and mix them in 3500 parts of pure water. After ball milling and dispersing for 30 minutes, add 70 parts of NaOH to it. After 12 hours of ultrasound-assisted reaction at 90°C, add hydrochloric acid to adjust the pH value at 5- 6, a uniform dispersion of activated boron nitride was obtained.

[0066] Configuration 2wt%H 2 100 parts of O / ethanol mixed solution, add 1 part of coupling agent KH550 and 2.3 parts of coupling agent KH570, and stir at 60°C for 5 minutes, adjust the pH value of the system to between 3-4, and continue stirring for 20 minutes, An activated coupling agent solution is obtained.

[0067] Pour the activated coupling agent solution into the uniform dispersion of activated boron nitride, continue to stir at 70°C for 6 hours, filter and wash the product with water several times until the pH value of the filtrate is between 7-8; finally, put After the filter cake was rinsed with ethanol and toluene in sequence, the modifi...

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Abstract

The invention belongs to the technical field of communication materials, and particularly relates to a prepreg prepared from boron nitride modified by a continuous method and a high-thermal-conductivity thermosetting high-frequency copper-clad plate. The preparation method comprises the following steps: firstly preparing a uniform dispersion liquid of activated boron nitride, then preparing an activated coupling agent solution, mixing the activated coupling agent solution with the uniform dispersion liquid of activated boron nitride to obtain modified boron nitride, then adding matrix resin and modified boron nitride into an internal mixer, and banburying to obtain the thermosetting compound. And finally, the thermosetting compound is molded by an injection molding method, an extrusion method, a mold pressing method or a blade coating method and then is heated to prepare a prepreg, the prepreg can be laminated with a film and a copper foil, and the high-thermal-conductivity thermosetting high-frequency copper-clad plate is prepared by a laminating process.

Description

technical field [0001] The invention belongs to the technical field of communication materials, and in particular relates to a prepreg prepared by boron nitride modified by a continuous method, and a high-thermal conductivity thermosetting high-frequency copper-clad board. Background technique [0002] Copper clad laminates are widely used in mobile phones, computers, wearable devices, communication base stations, satellites, unmanned vehicles, drones, and intelligent robots, and are one of the key materials in the electronic communication and information industries. [0003] At present, the thermosetting hydrocarbon board using polybutadiene as the matrix resin has attracted wide attention due to the rapid development of 5G communication. It has low dielectric loss, low thermal expansion coefficient, high bending strength, and high thermal-mechanical stability. and other comprehensive advantages. [0004] However, traditional polybutadiene-based thermosetting hydrocarbon b...

Claims

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Application Information

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IPC IPC(8): C08L51/00C08L71/12C08L53/02C08L63/00C08K9/02C08K3/38C08K9/06C08J5/18B32B9/00B32B9/04B32B15/08B32B15/20B32B27/00B32B27/06B32B37/10B32B37/06
CPCC08J5/18B32B9/00B32B9/04B32B15/08B32B15/20B32B27/00B32B27/06B32B37/10B32B37/06C08J2351/00C08J2471/12C08J2453/02C08J2463/00C08K9/02C08K2003/385C08K9/06
Inventor 顾书春俞卫忠俞丞冯凯蔡雨轩
Owner CHANGZHOU ZHONGYING SCI & TECH CO LTD
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