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Preparation method and application of toughened high-thermal-conductivity filler based on thermosetting resin

A high thermal conductivity filler and thermosetting technology, applied in the field of preparation of functional thermosetting resin fillers, can solve the problems of poor toughness and low thermal conductivity of thermosetting resins, and improve thermal conductivity, toughness and thermal conductivity, and improve the ability to resist external damage. Effect

Active Publication Date: 2022-05-03
HARBIN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problems of poor toughness and low thermal conductivity of existing thermosetting resins, the present invention provides a preparation method and application of a toughened high thermal conductivity filler based on thermosetting resins

Method used

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  • Preparation method and application of toughened high-thermal-conductivity filler based on thermosetting resin
  • Preparation method and application of toughened high-thermal-conductivity filler based on thermosetting resin
  • Preparation method and application of toughened high-thermal-conductivity filler based on thermosetting resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] 1. The raw materials for preparing the toughened high thermal conductivity filler in this embodiment are as follows in parts by weight:

[0036] 40 parts of hexamethylene diisocyanate trimer, 20 parts of methyl nadic acid anhydride, 40 parts of amino-terminated nitrile rubber, 20 parts of toluene diisocyanate, 0.5 parts of graphene oxide (purchased from Suzhou Carbonfeng Graphene Technology Co., Ltd. ).

[0037] 2. The operation process for preparing the toughening and high thermal conductivity filler of this embodiment is as follows:

[0038] (1) First, disperse graphene oxide in absolute ethanol, disperse it by ultrasonic wave at room temperature for 8 hours at a speed of 20r / min, then add TDI dropwise at a speed of 10drop / min in a nitrogen environment at 0°C, and the addition is completed Then continue to react for 12 hours, wherein the mass of TDI added is 40 times of that of graphene oxide.

[0039] (2) After the reaction is completed, add deionized water, centri...

Embodiment 2

[0049] The difference between this embodiment and Example 1 is that in step (1), hydroxylated multi-walled carbon nanotubes are used instead of graphene oxide, HDI is used instead of TDI, and the amount of HDI added is 20 times that of hydroxylated multi-walled carbon nanotubes ; Use dodecyl succinic anhydride phthalic anhydride to replace methyl nadic anhydride in step (2), adopt TDI trimer to replace HDI trimer, adopt end-epoxy group nitrile rubber to replace amino-butadiene rubber, all the other steps and Parameter settings are all the same as in Example 1.

[0050] Compound the filler obtained in this example, E-51 epoxy resin and methyl tetrahydrophthalic anhydride curing agent according to the mass ratio of 1:50:20. After curing at 170°C for 5 hours, the thermal conductivity of the obtained resin is 0.3813W / m K, the modulus of elasticity is 1744.6N / mm 2 .

Embodiment 3

[0052] The difference between this embodiment and Example 1 is that in step (1), hydroxylated multi-walled carbon nanotubes are used instead of graphene oxide, IPDI is used instead of TDI, and the amount of HDI added is 20 times that of hydroxylated multi-walled carbon nanotubes ; Use unsaturated anhydride in step (2) to be methyltetrahydrophthalic anhydride to replace methylnadic acid anhydride, adopt TDI trimer to replace HDI trimer, and all the other steps and parameter settings are the same as in Example 1.

[0053] Compound the filler obtained in this example, E-51 epoxy resin and methyl tetrahydrophthalic anhydride curing agent according to the mass ratio of 1:50:20. After curing at 170°C for 5 hours, the thermal conductivity of the obtained resin is 0.3671W / m K, the modulus of elasticity is 1533.577N / mm 2 .

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Abstract

The invention discloses a preparation method and application of toughened high-thermal-conductivity filler based on thermosetting resin, and belongs to the technical field of functional thermosetting resin filler preparation. The preparation method comprises the following steps: firstly, grafting and modifying a functionalized carbon material by using isocyanate, and then bonding with nitrile rubber to obtain the filler for improving the performance of the thermosetting resin. The filler prepared by the invention can effectively improve the toughness and heat conductivity of the material, so that the heat conductivity coefficient of the epoxy resin E-51 is improved to 0.3813 W / m.K, and the elastic modulus is improved to 1744.6 N / mm < 2 >.

Description

technical field [0001] The invention relates to a preparation method and application of a thermosetting resin-based toughened high thermal conductivity filler, and belongs to the technical field of preparation of functional thermosetting resin fillers. Background technique [0002] Thermosetting resin is a kind of resin with excellent performance. The molecules of thermosetting resin are cross-linked during curing (such as epoxy resin and bismaleimide resin). During the cross-linking process, a network structure is formed, which has high rigidity and high hardness. And has excellent heat resistance, dimensional stability and chemical resistance. However, due to the high cross-linking density of the cured product and the short distance between the polymer chain segments, it is difficult to rotate the molecular chain segments in a single room. This makes the rigidity of the material too large, resulting in poor toughness of the material, which is prone to brittle fracture, wh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G83/00C08L63/02C08L87/00
CPCC08G83/001C08L63/00C08L87/005
Inventor 张笑瑞徐航于杨翁凌朱兴松刘凯旋
Owner HARBIN UNIV OF SCI & TECH
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